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ISTFA - Portland, Going on Now!

Posted by Susan Campbell on Wed, Nov 13, 2019 @ 12:58 PM

Integra-ISTFA-2019Stop by Booth #203 at ISTFA at the Portland Convention Center today and tomorrow to say 'Hi' to Sultan and Mark! Let them help you with your Failure analysis and Analytical Service Needs!

Not able to make the show? Contact our sales group today sales_inquiry@integra-tech.com. They are looking forward to hearing from you.

BGA's with Tin Lead Solder Balls

Posted by Susan Campbell on Tue, Nov 05, 2019 @ 09:35 AM

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No Re-Balling Required with Integra’s On-shore Plastic BGA Assembly Capabilities

  • bga-tin-lead2We offer open-tooling (JEDEC Standards) CSBGA (CSBGA (CHIP SCALE BGA) at our Milpitas, Calif facility
    • Body sizes: Virtually Unlimited
    • Mold caps: 0.60, 0.80, 1.0 1.25mm
    • Total profiles vary by substrate
    • Ball pitch: 0.40mm & Larger
  • We attach the tin/lead solder during the assembly process on our BGA packages. No re-balling or re-work needed; one reflow process
  • Meets the requirements for Commercial, Industrial, Medical and Aerospace customers
  • If custom BGA package is required, please contact us. We will tool custom plastic BGAs with reasonable development NREs

Our engineering team works with customers to help identify and solve existing and potential IC packaging issues, sparing customers from costly packaging delays and potential failures due to rework. We will develop manufacturable package solutions for next-generation, high-volume production. Integra Technologies has the experience to meet your most demanding advanced packaging challenges including SiP, MCM, RF Modules and Stacked assemblies.

Tin/Lead Solder Balls for your BGAs from the get-go; look no further than Integra Technologies, Silicon Valley

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Integra is at IMAPS Boston NOW!

Posted by Susan Campbell on Wed, Oct 02, 2019 @ 09:35 AM

imaps-boston-2019Stop by booth #401 at IMAPS Boston today and tomorrow and say Hi to John and Richard.

They are eager to discuss Integra Technologies' capabilities in manufacturing multi-chip devices, surface mount assemblies, and flip chip and wire bond interconnects, enable the development of complete system-in-package solutions to improve performance and reduce footprint.

Integra Technologies at IMAPS Today!

Posted by Susan Campbell on Tue, Oct 01, 2019 @ 08:21 AM

Visit Integra Technologies September 30 - October 3 - Boston, MA - Booth #401


As a high-performance IC packaging provider, Integra Technologies can design, assemble and test custom System-in-Package (SiP) devices. By combining the functionality of a complete system into one packaged device, a SiP solution offers reductions in size, weight and power that are critical to next-generation performance in Aerospace, Industrial and Medical applications. In addition, a SiP solution reduces interconnect and trace lengths, minimizing the impact of parasitic and improving overall electrical performance.

Integra Technologies' capabilities in manufacturing multi-chip devices, surface mount assemblies, and flip chip and wire bond interconnects, enable the development of complete system-in-package solutions to improve performance and reduce footprint.

Stop by the booth today and say Hello to the Integra Team!

IMAPS Advanced System and Technology Conference Follow Up

Posted by Susan Campbell on Mon, Jul 01, 2019 @ 10:18 AM

Thank you to all who visited us last week at the IMAPS Advanced System and Technology Conference. It was a great turn out and we enjoyed speaking with you all. Please let us know if you have any questions or projects to discuss with our sales team. We look forward to hearing from you!

IMAPS 2019    kirk-imaps2019

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Visit Us at the IMAPS Advanced System in Package Technology Conference and Exhibition June 25-27

Posted by Susan Campbell on Thu, Jun 20, 2019 @ 10:42 AM
 

Integra's System-in-Package & MCM solutions offer the capabilities of a complete system in one device. As a high-performance IC packaging provider, Integra Technologies can design, assemble and test custom System-in-Package (SiP) devices. Our SiP solutions can help product developers achieve next-generation performance levels. By combining the functionality of a complete system into one packaged device, a SiP solution offers reductions in size, weight and power (SWaP) that are critical to next-generation performance in defense and medical applications.

Stop by the IMAPS Advanced System in Package (SiP) Technology Conference and Exhibition, Tues-Thurs, June 25-27 and talk to us more on how we can help with your SiP needs! 

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Integra Announces New Headquarters

Posted by Susan Campbell on Wed, May 15, 2019 @ 10:38 AM

WICHITA, KS - May 15, 2019-Integra Technologies LLC, a world leader in semiconductor packaging, assembly, test, characterization and related services, today announced it has moved it's corporate offices into a new facility in Wichita to accommodate rapid company growth. Expanding by 14,000 sq feet, the new location will house the company's administrative, sales, and support staff, making Integra's total footprint approximately 115,000 sq feet. 

The expansion is due to the increase in business the Qualification, Design Verification and Reliability Testing Services division has encountered over the last year. In 2018, Integra Wichita completed over600 complex military and aerospace part qualifications, having processing times of 12 – 26 weeks each.

Corporate Headquarters

Integra’s Wichita factory is on pace to perform over 700 complex military and aerospace part qualifications in 2019. With the increased demand, Integra made the decision to move the corporate staff out of the Wichita factory to allow for further expansion of production capabilities. Integra plans to further increase the production space in 2019 adding new equipment and engineering staff.

"The move will allow us to better serve our entire customer base of semiconductor manufacturers, military/space/aerospace, automotive OEMs, and medical device customers by increasing our capacity and reducing lead times," said Brett Robinson Integra’s President & CEO. "Integra is currently seeing rapid increase in production at all three factory locations. We are looking forward to continued growth throughout the rest of 2019 and beyond." 

The corporate office remit to address remains the same, 3450 N. Rock Rd., Bldg #100, Wichita, KS 67226. For more information contact Integra Technologies, sales_inquiry@integra-tech.com

Heterogeneous Integration Roadmap Symposium 2/21-2/22

Posted by Susan Campbell on Mon, Feb 25, 2019 @ 11:47 AM

HIR-conf-2019-1There was a great turn out at this year's Heterogeneous Integration Roadmap Symposium in Milpitas, CA last week. We would like to thank all who attended!

HIR-conf-2019-2As a high-performance IC packaging provider, Integra Technologies can design, assemble and test custom System-in-Package (SiP) devices. By combining the functionality of a complete system into one packaged device, a SiP solution offers reductions in size, weight and power that are critical to next-generation performance in Aerospace, Industrial and Medical applications. In addition, a SiP solution reduces interconnect and trace lengths, minimizing the impact of parasitic and improving overall electrical performance.

Integra Technologies' capabilities in manufacturing multi-chip devices, surface mount assemblies, and flip chip and wire bond interconnects, enable the development of complete system-in-package solutions to improve performance and reduce footprint.

 

 

MEPTEC Symposium Today!

Posted by Susan Campbell on Wed, Dec 05, 2018 @ 01:13 PM

Stop by the Integra booth today and say hello to Rafi, Chip and Richard, 9:30 - 6:30 p.m.

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MEPTEC Symposium, December 5

Posted by Susan Campbell on Tue, Dec 04, 2018 @ 08:00 AM

Visit Integra Technologies at MEPTEC's 'Heterogeneous Integration' Symposium, this Wednesday, December 5th from 8:00 - 5:00 with exhibits and reception to follow.

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