Integra Technologies is excited to announce the addition of a TOWA Compression Molding unit to their Silicon Valley facility. The unit will allow Integra to provide customers inhouse compression molding for various types of devices including Integrated Circuits (ICs), Microprocessors, Memory Chips (DRAM, SRAM, Flash), Sensors and MEMS (Micro-Electro-Mechanical Systems), Power Devices (MOSFETs, IGBTs), and Optoelectronic Devices (LEDs, Photodiodes).
Benefits of the TOWA CPM1080:
- Reduced wire sweep and void
- Granular mold compound
- Film assisted
- Mold underfill capable
- Capable of wafer level molding
- No set strip size
- Wire bond max width 110mm
- Wafer level molding
“With the advent of more System in packages (Heterogeneous Integration of various platforms such as PIC to Logic interconnect) it has become necessary to have a technology to accommodate flip-chip and wire bonded devices in the same package i.e. mold underfill. Compression molding has become necessary for chip-on-chip interconnect and chip on wafer.” said Mario Aguirre, Integra Senior Project Engineer. “The CPM1080 allow us to offer wafer molding using various materials such as Fuse Silica wafers.”
TOWA Compression Molding provides efficient and reliable encapsulation of semiconductor dies within protective molding compounds. Integra is looking forward to taking advantage of its high production yield, uniform encapsulation, excellent mechanical properties, thermal management capabilities, and cost-effectiveness.