Capabilities
Die Prep
Wafer thinning
Wafer dicing
Pick and Place
Die Inspection
Packaging & Assembly
SiP/MCM
Die attach
Standard IC Packages
Flip Chip Interconnect
Encapsulation
Quick Turn
Electrical Test
Total Test
Device Upscreen
Wafer Probe
Singulated Die Probe
FPGA
Custom ASIC/FPGA
Reliability & Qualification
PEM Qualification
Cu Wire Evaluation
ESD Services
Other
DPA & FA
Laser ablation
DPA
FA
Other
Counterfeit Detection
Other Services
Obsolescence Management
BOM Management
Parts Management Program
Facilities
Contact
Quality
Careers
Resources
About Integra
Media
News & Updates
FAQ
Webinars
Videos
Presentations
Guides
White Papers
Terms and Conditions
Terms and Conditions
Terms and Conditions
Purchase Order Terms and Conditions
New Supplier Information
Credit Information
Mutual NDA
