Integra Technologies, the Global Leader in Wafer Processing and Test

To our Business Partners and Customers,

Integra Technologies is committed to you during the ongoing coronavirus situation. While this is a developing situation, please know that all 3 of Integra’s facilities continue to operate at normal capacity.

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Wafer Thinning & Polishing Wafer Dicing Die Pick & Place Die Inspection	Die Attach Standard IC Packages Interconnect Encapsulation Package Assembly Capabilities Chart	SiP/MCM BOM Procurement Program Management	Total Test Solution Device Up Screening Wafer Probe	PEM Qualification Cu Wire Evaluation ESD Services Additional Services	Laser Ablation Destructive Physical Analysis Failure Analysis Additional Services DPA/FA Portal

NEXT WEBINAR:
Obsolescence Management for EEE Parts - Wednesday, July 29, 2020, 1:00 p.m. PST

Previous Webinar Notes:

May 27, 2020: Standards of PEM Qual and Technical Requirements Review - Integra is the leader in performing PEM (Plastic Encapsulated Microcircuits) screening, qualification and DPA for the Aerospace and Defense market.

June 24, 2020: Testing of Complex FPGAs, Memory and Microprocessors - Integra has developed over 10,000 test programs including these complex devices. This Webinar will explore the nuances of how such complex devices are tested.