Die Prep Processes and Overview
October 22, 2020: Advanced Packaging Overview –Design through Assembly and Test: Flip Chip and SiP Packages DOWNLOADS NOTES
August 26, 2020 & September 9, 2020: Mil-Std-1580 DPA Including DPAs for Copper Bond Wire PEMs DOWNLOAD NOTES
July 29, 2020: Obsolescence Management for EEE Parts - Learn more about Integra's services to support Military/Space/Aerospace companies threatened with diminishing sources of supply for semiconductor and related EEE parts DOWNLOAD NOTES
June 24, 2020: Testing of Complex FPGA's, Memory and Microprocessors - Integra has developed over 10,000 test programs including these complex devices. This webinar will explore the nuances of how such complex devices are tested. DOWNLOAD NOTES
May 27, 2020: Standards of PEM Qual and Technical Requirements Review - Integra is the leader in performing PEM (Plastic Encapsulated Microcircuits) screening, qualification and DPA for the Aerospace and Defense market. DOWNLOAD NOTES
INTEGRA TECHNOLOGIES' GENERAL GUIDE FOR ASSEMBLY SERVICESLearn how to make your products cost effective and designed for manufacture through the help of this detailed guide!
To our Business Partners and Customers,
Integra Technologies is committed to you during the ongoing coronavirus situation. While this is a developing situation, please know that all 3 of Integra's facilities continue to operate at normal capacity. 
