Integra provides a span of in-house services and capabilities to support a broad variety of Hi-Rel components throughout the entire value-added life-cycle - from prototyping, through testing, and ultimately to volume production. More specifically, Integra specializes in semiconductor die prep, packaging, assembly, test, reliability qualification, DPA and FA service for high-reliability applications.

VISIT US:

• IMAPS - Device Packaging, March 2-5, Fountain Hills, AZ

• GOMACTech 2020, March 16-19, San Diego, CA Booth #213

• Die Attach
• Standard IC Packages
• Interconnect
• Encapsulation
• Package Assembly Chart

• SiP/MCM
• BOM Equipment
• Project Management

• Total Test Solution
• Device Up Screening
• Wafer Probe

• PEM Qualification
• Cu Wire Evaluation
• Additional Services

• Laser Ablation
• Destructive Physical Analysis
• Failure Analysis
• Additional Service