Integra Technologies LLC provides semiconductor production testing (wafer probe and final test), qualification, and related technical services to manufacturers and users of semiconductor devices. In business for more than 30 years, we serve the Fabless Semiconductor, Aerospace, Space, Military, Medical, Automotive, Industrial and Commercial markets with our test services.
Integra offers these services from its locations in Wichita, Kansas and Albuquerque, NM and has earned an outstanding reputation for quality, technical expertise and on-time delivery.
Integra has one of the largest and most experienced test engineering organizations in the industry. We have the engineering expertise in house to support all technologies, including RF, digital, linear, analog mixed signal and memory.
Integra specializes in software development, hardware design and development, full production electrical test, qualification testing, failure analysis and destructive physical analysis. Integra’s electrical test expertise encompasses both final test and wafer probe, including bumped wafer probe.
Military Test Expertise
Integra provides a comprehensive array of services to support Military/Space/Aerospace companies that require devices for use in applications that are more demanding than commercial or industrial devices are typically designed for - sometimes requiring higher security levels of ITAR and DOD-DMEA Trusted processing.
Semiconductor Test Expertise
Integra Technologies can support you with every post-wafer fabrication manufacturing service necessary to deliver a finished integrated circuit to your end customer!
Featured Technology Solutions - Wafer Probing
Integra Technologies is a Leader in Wafer Probing!
- 20+ years of wafer probe experience
- 100 million plus die probed
- 2" to 12" wafers
- Bumped or Un-Bumped
- Singulated die probing
- Multi-Site parallel (64 sites)
- Temp ranges from -55C to +125C
- RF Probe to 40GHz and higher
- Probe counts to 8000+ probes
- 5 mil thick wafers
- 24 x 7 production capability
- 25+ test engineers
- Probe card design, fab and verification
- Al, Au pads and Pb, Pb free bumps
- High Z force chuck
- High pin count, fine pitch
- Vertical, Cantilever, Membrane & MEMS probe cards
- RF probe (Membrane, Coax or custom solutions)
- N2 and vacuum wafer storage
- Elevated probing up to 180°C
- Wafer map conversion
- Retest of defined bins without full wafer reprobe
- Custom mapping for inkless assembly
- Onsite custom format solutions for inkless assembly
- Assembly back to production map conversion
- Wafer inspection map conversion to electrical test maps
- Composite mapping
- Multi site comparison
- Integration to Galaxy® software
Integra Technologies - Full Service Semiconductor Testing
Quality Certifications
