Integra Technologies, the Leader in USA Die Prep, Assembly, Test & Qual Services

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Mil-Std-1580 DPA Tutorial Including DPAs for Copper Bond Wire PEMs
Wednesday, February 24, 2021  12:30 PM PST
 
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Coming Soon!
  • Flip Chip
  • Silicon Photonics
  • Testing of Complex Semiconductors
 
Previous Webinars:

die-prepDecember 2, 2020: Die Prep Processes and Overview - While quality, functional parts are the end goal for all semiconductor companies, getting from fab to the assembly line is often an undervalued aspect of the IC supply chain. DOWNLOAD NOTES

October 22, 2020: Advanced Packaging Overview –Design through Assembly and Test: Flip Chip and SiP Packages DOWNLOAD NOTES

August 26, 2020 & September 9, 2020: Mil-Std-1580 DPA Including DPAs for Copper Bond Wire PEMs DOWNLOAD NOTES

July 29, 2020: Obsolescence Management for EEE Parts - Learn more about Integra's services to support Military/Space/Aerospace companies threatened with diminishing sources of supply for semiconductor and related EEE parts DOWNLOAD NOTES

June 24, 2020: Testing of Complex FPGA's, Memory and Microprocessors - Integra has developed over 10,000 test programs including these complex devices. This webinar will explore the nuances of how such complex devices are tested. DOWNLOAD NOTES

May 27, 2020: Standards of PEM Qual and Technical Requirements Review - Integra is the leader in performing PEM (Plastic Encapsulated Microcircuits) screening, qualification and DPA for the Aerospace and Defense market. DOWNLOAD NOTES


 
assembly-guide-download2INTEGRA TECHNOLOGIES' GENERAL GUIDE FOR ASSEMBLY SERVICES

Learn how to make your products cost effective and designed for manufacture through the help of this detailed guide!

 


To our Business Partners and Customers,

Integra Technologies is committed to you during the ongoing coronavirus situation. While this is a developing situation, please know that all 3 of Integra's facilities continue to operate at normal capacity.  integra-technologies


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