Integra Technologies has the largest Test Engineering group in the industry, with 25+ Test Development Engineers & 30+ total technical staff (Product Engineers).

Integra provides extensive experience with complex test development:
  • Digital & Mixed Signal Devices: Microprocessor, Microcontrollers, FPGA, DSP, ASIC
  • Linear: DAC, ADC, Operational Amplifier, Comparator, Multiplexer, Interface, Discrete
  • Logic: 74xxx, 16/32-bit, ECL
  • RF, 8GHz typical and experience to RF 50GHz: PA, LNA, Filter, Mixer
  • Can fully test at the wafer, bare die and packaged part level
  • Test temps from -65ºC to +200ºC
  • In house custom test development
  • "Extreme" characterization capability, making 1000's of measurements per device
  • Existing test library with 1000+ programmable device test programs from a variety of manufacturers


Integra Technologies has been accredited by The Defense Microelectronics Activity (DMEA) as a DoD Category 1A Trusted Integrated Circuit Supplier for Test & Broker Services. As a Trusted test supplier, Integra offers semiconductor test software development, testing, qualification, characterization and other related technical services. Integra’s electrical test services encompass both final test and probe. Integra has one of the largest and most experienced test engineering organizations in the industry and has earned an outstanding reputation for quality, consistency, and on-time delivery. Integra’s engineering staff of 25+ experienced engineers and installed base of 35+ test systems is capable of handing all device technologies including RF, Digital, Analog, Linear and Mixed Signal.

Complete Test Solution
  • Design & FAB Load Boards
  • Design & FAB Probe Cards
  • Design & FAB Burn-in Boards
  • Design & FAB HAST Boards
  • Design & FAB ESD Test Fixtures
  • Develop & ExecuteCharacterization Plan
  • Develop & Execute Qualification Plan
  • Pre-Production Wafer Probe
  • Pre-Production Package Test
  • Production Wafer Probe
  • Production Package Test


Up-screening is the testing a device to a wider temperature range than the original manufacturer specified. Up-screening a device does not subject it to any environmental stresses (Temp Cycle, HAST, etc.).

The semiconductor suppliers today primarily develop new devices for the commercial consumer electronics markets where devices are typically tested from 0°C to +70°C. However the demand for sophisticated electronics in the military, space and industrial markets is higher than ever. Many of the applications in these markets must exist in a harsh, high-temperature environment. The typical operating temperature range for industrial applications is -40°C to +85°C and -55°C to +125°C for military and space applications. The only way to assure commercial temperature range devices can operate at these extended temperature ranges is to perform full AC/DC/Functional testing to “Upscreen” them for these harsher environments.

Integra has successfully upscreened millions of devices for our customers.


Integra Technologies has the engineering talent, equipment and processes in place to support all wafer probe services, including test software development, probe card design/fabrication, debug and production probing.

Experience with all probe card technologies including:
  • Cantilever: 1- 16 sites up to 800 probes
  • Vertical: Multi site up to 64 sites
  • Membrane: Multi site
  • MEMS probe cards
  • RF probe to 40 GHz and higher
  • Wafer probing -55°C to +125°C
  • Elevated probing up to 180°C
  • Singulated die probe, -55°C to +125°C, pin count to 8000+ pads
  • Bumped or unbumped wafer probe
Summary of Probe Capabilities
  • Known Good Die (KGD)
  • Wafer Level/Chip Scale Packaging (WLP or CSP)
  • Bumped or copper pillar wafers
  • Tight pitch aluminum or gold pads
  • Thin wafers
  • Digital, Mixed Signal and RF probe
  • 2” to 12” wafer capability
  • Probe card design, fab and verification
  • Al, Au pads and Pb, Pb free bumps
  • High Z force chuck
  • High pin count, fine pitch
  • Multi site
  • RF probe (Membrane, Coax or custom solutions)
  • N2 and vacuum wafer storage
  • Data analysis capability
  • High volume production probe
  • 5 mil thick wafers
  • 20+ years of wafer probe experience
  • 100 million plus die probed
  • 24x7 production capability
  • 25+ test engineers
Wafer probe data analysis throughout your startup and ongoing production probe:
  • Wafer Map Conversion
  • Retest of defined bins without full wafer reprobe
  • Custom mapping for inkless assembly
    • Onsite custom format solutions for inkless assembly
    • Assembly back to production map conversion
    • Wafer inspection map conversion to electrical test maps
  • Wafer Analysis
    • Composite Mapping
    • Multi site comparison
    • Integration to Galaxy® software


Integra offers a complete suite of singulated die probing and testing services!

Bare die testing is essential for optimizing yields in the following applications:

  • Multi-Chip Modules
  • System in Package
  • Die Reclamation and Repackaging
  • Hybrid Microcircuits

Integra die probing and testing capabilities include:

  • Die pad-counts from 2 to 8,000+
  • Temperatures from -55ºC to +125ºC
  • Device complexities from simple discretes to complex FPGAs & Microprocessors
  • Device speeds of 50GHz+
  • Minimal probe marks on pad
  • Precise micro manipulation for X, Y, Z and θ adjustment



Integra Technologies provides industry leading Field Programmable Gate Array (FPGA) test and obsolescence solutions.

We provide a comprehensive array of test capability, characterization, qualification and obsolescence management solutions.

  • Support all programmable logic families - FPGA, CPLD, PLD, etc.
  • Support all programmable logic manufacturers - Xilinx, Intel/Altera, Actel/Microsemi, Lattice
  • Pin counts to 2000+


Integra offers complex digital testing up to ~1800 pins and 1GHz+

Full ASIC test development and production screening (Wafer Probe and Package Test)

  • Can translate simulation outputs from most major design tools
  • 100's of Millions of Pattern File Test Vector Depth supported
  • Full support for BIST/SCAN and other testability features
  • Synchronous/Asynchronous

Experience with many complex digital device types

  • FPGA (more FPGA's developed than any other test lab)
  • Memory (DDR2/DDR3/NOR/NAND)
  • Controllers
  • Integrated Mixed signal

Want to learn more?

Contact our team today to learn more about our electrical test services, tell us about your project needs and get your free quote, 100% risk-free.