FAQs

MARCH 2025 Dicing and Die Prep Semiconductor dicing and die preparation are essential and intricate steps in the semiconductor fabrication

FEBRUARY 2025 Die Inspection Die inspection for semiconductors is a critical process that ensures the quality and reliability of

January 2025 Compression Molding

December 2024 Copper Bond Wire

November 2024 Laser Marking

OCTOBER 2024 PEM

SEPTEMBER 2024 Silicon Photonics

AUGUST 2024 Semiconductor Obsolescence

JULY 2024 Semiconductor Materials

JUNE 2024 RF Testing

MAY 2024 Advanced Packaging

APRIL 2024 Testing 2.5D Heterogeneous Packaged Parts

MARCH 2024 What is Semiconductor Assembly

FEBRUARY 2022 Destructive Physical Analysis (DPA) Take a look at some of our most frequently asked questions:

JANUARY 2024 What is Semiconductor Assembly and Test

December 2023 FAQ: Die-to-Wafer Bonding

November 2023 FAQ: SET-NA 150 Bonding

October 2023 FAQ: QFNs

September 2023 FAQ: Ribbon Bonding

August 2023 FAQ: Laser Marking

July 2023 FAQ: Eutectic Bonding

June 2023 FAQ: Integra Technologies' Test and Qualification Capabilities

May 2023 FAQ: Dice Before Grind (DBG) Dice Before Grind (DBG) Take a look at some of our most frequently asked questions:

April 2023 FAQ: Automated Die Picking Automated Die Picking Take a look at some of our most frequently asked questions:

March 2023 FAQ: Silicon Photonics Fiber Connect Take a look at some of our most frequently asked questions:

February 2023 FAQ: Die Attach Take a look at some of our most frequently asked questions:

January 2023 FAQ: Wafer Thinning Take a look at some of our most frequently asked questions:

FAQ: How to Get an Assembly or Die Prep Quote from Integra

November 2022 FAQ: Prototypes For quick-turn prototyping, Integra is unsurpassed in producing highly complex products such as Flip Chip

October 2022 FAQ: Qualification Integra Technologies is an industry leader in providing qualification, design verification and reliability

September 2022 FAQ: Electrical Testing Take a look at some of our most frequently asked questions:

August 2022 FAQ: Flip Chip Take a look at some of our most frequently asked questions:

July 2022 FAQ: SiP As ICs become faster, smaller and more complex the need for innovative packaging solutions has increased. Integra has

June 2022 FAQ: PEM Integra Technologies has more experience with PEM quals than any other test lab. The following are some of the

May 2022 FAQ: Dicing and Die Prep Integra provides quick-turn and volume die prep to many customers. Here are some of our frequently

March 2022 FAQ: Testing Complex Microcircuits Take a look at some of our most frequently asked questions:

February 2022 FAQ: DPA Take a look at some of our most frequently asked questions:

November 2021 FAQ: Wafer Thinning Take a look at some of our most frequently asked questions:

October 2021 FAQ: Services Offered at our Albuquerque Analysis Lab Take a look at some of our most frequently asked questions:

September 2021 FAQ: Die Attach Take a look at some of our most frequently asked questions:

August 2021 FAQ: Silicon Photonics Fiber Connect Take a look at some of our most frequently asked questions:

July 2021 FAQ: Automated Die Picking Automated Die Picking Take a look at some of our most frequently asked questions:

June 2021 FAQ: Dice Before Grind (DBG) Dice Before Grind (DBG) Take a look at some of our most frequently asked questions:

May 2021 FAQ: How to Receive a Test or Qualification Quote from Integra How to Receive a Test or Qualification Quote from Integra Take a

April 2021 FAQ: Integra Technologies' Test and Qualification Capabilities

March 2021 FAQ: How to Get an Assembly or Die Prep Quote from Integra

February 2021 FAQ: Prototypes Take a look at some of our most frequently asked questions:

January 2021 FAQ: Qualification Take a look at some of our most frequently asked questions:

December 2020 FAQ: Electrical Testing Take a look at some of our most frequently asked questions:

November 2020 FAQ: Flip Chip Take a look at some of our most frequently asked questions:

October 2020 FAQ: SiP As ICs become faster, smaller and mbackground-color: transparent;">ore complex the need for innovative packaging

September 2020 FAQ: PEM Integra Technologies has more experience with PEM quals than any other test lab. The following are some of the

August 2020 FAQ: Die Inspection Integra provides die inspection for millions of die per month.

July 2020 FAQ: Dicing and Die Prep Integra provides quick-turn and volume die prep to many customers. Here are some of our frequently