August 2022 FAQ: Flip Chip

Take a look at some of our most frequently asked questions:

flipchip1Q:  What is a Flip Chip Package?

A:  Essentially, the name “Flip Chip” describes the method used to connect a semiconductor die to a substrate: The dies are bumped and then “flipped” onto a substrate, hence the name “Flip Chip”.


Q: What are the typical benefits of a Flip Chip device vs. a wire bonded device?

A: Flip Chip package technology offer a range of benefits including:

  • High pin count
  • High signal density
  • Better power dissipation
  • Low signal inductance, and good power/ground connectivity.
  • Ideal for high speed interfaces (including RF) that wire bonds cannot support

Q: What is a Flip Chip substrate?

A: Flip Chip substrate is in essence a small Printed Circuit Board (PCB) located inside the package.

  • Substrate design consists of layout of all signals from the package external balls to the bumped internal pads. It is because of a more direct path on the substrate (as illustrated below) that gives flip chip some of its advantages
  • Substrates can be made by different PCB materials: laminate, build-up, ceramic, and more. Substrate layout design rules vary from different suppliers.
  • Substrates can consist of many layers ranging from 2-18 layers to allow proper routing of all signals for enhanced device performance



Q: What are the Assembly Steps of a Flip Chip Device?

A: In order for the chip to be connected or mounted to a substrate, the die is turned or flipped over and brought into alignment with the pads located on the substrate. There are six (6) key process steps:  Fluxing, Placement, Reflow, Flux Cleaning, Capillary Underfill, and Cure.


Q:  What are some of your Assembly Guidelines for Flip Chip Devices?

A:  Please download our Assembly Guidelines – you can get them for free on our website


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