January 2023 FAQ: Wafer Thinning

die-prepTake a look at some of our most frequently asked questions:

Q:  What type of materials does Integra handle?

A: Silicon, SiGe, sapphire, glass, Indium Phosphide (InP), GaAs, III-V materials and others

Q:  What wafer sizes are handled?

A: Everything up to 300mm (12”)

Q:  Can Integra back grind individual die?

A: Yes

Q:  What is your standard thickness variation?

A: 12um – lower TTV available upon special request.

Q:  Are there any special considerations for bumped wafers?

A: Yes – bump height should be 50% of wafer thickness max in most cases.

Q:  What backside finishes are available at Integra?

A:  See below guidelinenov-table

Have more questions? Let us know sales_inquiry@integra-tech.com