November 2022 FAQ: Prototypes
For quick-turn prototyping, Integra is unsurpassed in producing highly complex products such as Flip Chip or wirebonded BGA or chip-scale devices with thousands of bumps or wire bonds. For new product development, where time-to-market is of utmost importance, especially in highly competitive markets, Integra customers will request quick-turns as fast as 8 to 24 hours
Take a look at some of our most frequently asked questions:
Q: What is your minimum quantity?
A: We have no minimum quantity – just minimum charges based on type of Prototype
Q: How fast can I turn a prototype at Integra?
A: A few hours to a few days – dependent on end product and requested service(s)
Q: Can I get a wafer diced in less than 24 hours?
A: Yes – in most cases
Q: What are the most popular inexpensive packages for low pin count die?
A: We find that our customers use our QFNs extensively for pin counts near or less than 100
Q: For larger pin count prototypes, what are popular packages
A: We find customers utilize ceramic packages for higher pin counts which can be very cost competitive for low volumes.
Q: What are the typical issues that you see with prototype requests
A: We typically see issues with wire bonds that are unrealistically long or crossed and mis-understandings of what should be executed as a flip chip and what can be done as a flip chip.
Q: What are the documentation needs for a prototype run at Integra?
A: A filled out CTC form, drawings of the die and the substrate/package, wire bond diagrams if applicable.