November 2023 FAQ: SET-NA 150 Bonding


FC150-2020With flip chip pitch capabilities down to 8µm the FC150 will enhance our capabilities for Heterogeneous Integration and Chiplet Assembly.

Take a look at some of our most frequently asked questions:

Q: What are Integra's NEW bonding capabilities?

A: Integra Technologies recently added a FC150 Automated Die/Flip Chip Bonder to its line up at their Milpitas, CA location.

Q: What materials does the FC150?

A: The FC150 accommodates a wide variety of materials, including extremely fragile materials such as GaAs and HgCdTe allowing easily changed bond processes. 

Q: What are some of the benefits of the FC150?

A: Some of the benefits include:

  • ± 1 µm post-bond accuracy and 20 µradian leveling guarantee high yields on the most advanced products
  • Semi-Open Confinement Chamber for Oxide Reduction (option)
  • Air bearing construction on a granite structure ensures long-term stability and reliability
  • Compression, Z-control and temperature profiling, together with process monitoring, maximize process control
  • Optical automatic leveling and alignment enables hands-off operation for production applications
  • Nanoimprint Lithography option with Hot Embossing or UV-NIL process without compromising the bonding capability

Q: What is the FC150 application range?

A: Chip-to-Chip, Chip-to-Substrate Bonding, Chip Stacking, 3D Interconnect, Optical Components and Photonics Device Packaging, MOEMS, MEMS, MCM,  and Nanoimprint Lithography

Q: What are some of the FC150 capabilities?

A: Capabilities include:

  • Bump pitch down to 8µm
  • Thermo Compression bonding
  • Conventional Die Attach
  • Ultrasonic bonding
  • Placement tolerance of 1µm

Find out more by downloading the General Guide for Assembly Services


Have more questions? Let us know: