September 2021 FAQ: Die Attach
Take a look at some of our most frequently asked questions:
Q: What type of die attach does Integra do?
A: Die attach using various conductive, non conductive epoxy and DAF ( Die-Attach-Film) as well as:
Die attach of ceramic, hybrid packages using silver glass adhesive
Eutectic die attach using Au98/Si2 & Au80/Sn20 preforms (capital required)
Integra will need to verify availability of preform sizes vs. die size
Sintered Silver also available under Engineering Control
Q: What are your X/Y placement accuracies?
A: MAT- 6400 die bonder: DIE ATTACH +/-5um @ 3sigma - Application dependent (+/- 10 um after die attach cure)
Data-con 2200 APM die bonder:
DIE ATTACH +/- 10 um (+/- 15 um after die attach cure)
Q: What die sizes can you work with?
A: 750um to 40mm typical and larger or smaller with engineering review
Q: What kind of bond line thickness control does Integra have?
A: Pressure and time control (for epoxy) : Target BLT +/- 12.5 um (die size dependent) Height or distance control (for silver glass) : Target BLT +/- 12.5 um
Q: For manual die attach how do you control bond line thickness?
A: We recommend the use of glass bead spacers for BLT control
Q: What kind of fillet and epoxy coverage do you guarantee?
A: We guarantee to meet or exceed MIL-STD-883, Methods 2010, 2012 and 2030