January 2025

Compression Molding

integra-towaSemiconductor Compression Molding is a manufacturing process used to encapsulate semiconductor devices, such as integrated circuits (ICs), in protective packaging materials. This process is crucial for ensuring the durability, reliability, and performance of the semiconductor components.
 

Take a look at some of our most frequently asked questions:

 

Q: What is compression molding?

A:  Compression molding involves placing liquid or granular resin directly into the cavity, where it melts before the workpiece is submerged for resin molding. This method minimizes waste by eliminating the need for a gate or runner, as required in the transfer method, thereby achieving nearly 100% resin efficiency.

Q: What are the benefits of compression molding?

A:  A notable advantage we've observed is the absence of 'flows' within the molding area, reducing the likelihood of wire sweep for wire-bonded parts. Other benefits include:

  • high production yield
  • uniform encapsulation
  • excellent mechanical properties
  • thermal management capabilities
  • cost-effective

Q: What compression molding system does Integra use?

A: Integra's system is manufactured by Towa - 

  • Standard strip = 200 x 70mm
  • Reduced wire sweep void
  • Granular mold compound
  • Film assisted
  • Mold underfill capable
  • Capable of wafer level molding

By providing robust and resilient packaging, compression molding ensures that each device can withstand the rigors of demanding environments, delivering unparalleled reliability and efficiency.

Have more questions? Let us know: sales_inquiry@integra-tech.com