FEBRUARY 2025
Die Inspection
Die inspection for semiconductors is a critical process that ensures the quality and reliability of semiconductor devices. This inspection involves examining the individual die, or chips, on a semiconductor wafer for defects, such as cracks, contamination, or improper dimensions. By identifying these issues early, manufacturers can prevent faulty products from reaching the market, ultimately enhancing performance and customer satisfaction. If you need more specific information or have a particular aspect in mind, feel free to ask!
Q: Why is die inspection important?
A: Die inspection provides:
- Defect detection and yield improvement
- Ensures performance and reliability - Defects in semiconductor dies can lead to failures in electronic devices, affecting their performance and longevity.
- Cost reduction - Detecting defects early prevents the need for costly rework or scrapping of entire wafers
- Process optimization and continuous improvement
- Compliance with industry standards
- Military 883 Cond A (Class S) & Cond B (Class B)
- Commercial MAS-2010 2nd Optical Inspection (Commercial)
- European standards (Requirements same or similar to Mil-Std 883).
- Customer Specific
- Military- Visual inspection criteria for inspecting microcircuit die must comply with MIL-STD-883, Method 2010. Either condition B or condition A.
- Commercial - Visual inspection criteria for inspecting microcircuit die is based on Industry & Military Standards generally acceptable requirements for commercial use.
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Air Bridge - A raised layer of metallization used for interconnection that is isolated from the surface of the semiconductor and/or passivation material. Metallization bridging and where a line of separation is not visible between adjacent metallization traces.
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Glassivation/Passivation Cracks - Fissures in the glassivation/passivation layer.
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Passivation - A layer of insulating material that covers the active circuit area including metallization.
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Glass over metal
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Glass covering more than 25% of a bond Pad
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Void in the glass that exposes two adjacent conductive circuit elements.
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Foreign Material - Any material that is foreign to the microcircuit or package, or any non-foreign material that is displaced from its original or intended position within the microcircuit package. Foreign material considered attached when a gas blow of nitrogen cannot remove it. Foreign material is considered embedded in the glassivation when there is evidence of color fringing around the periphery of the foreign material and it cannot be removed by a gas blow of nitrogen
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Void - Any region in the metallization, glassivation / passivation or die attach material not caused by a scratch, where there is a complete absence of the relevant material within the designed areas and underlying material is exposed.
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Chip-out - Any section of the die which has broken away from the main body of the die.
Semiconductor die inspection is crucial for maintaining quality, reducing costs, and ensuring the reliability of modern electronic devices. As semiconductor technology advances, the need for precise and efficient inspection methods will continue to grow, playing a key role in the success of semiconductor manufacturers.