DIE PREP SERVICES
Integra Technologies Silicon Valley, previously CORWIL Technologies, specializes in ultra-thin precision wafer thinning and polishing down to 25µm.
Our Services include:
- Wafer Thinning & Polishing
- Wafer Dicing
- Die Pick & Place
- Die Inspection
- All processes capable up to 300mm wafers
Integra has the most saw capacity of any North American subcontract manufacturer and can process virtually any material, including Silicon, Gallium Arsenide (GaAs), Indium Phosphide (InP), Sapphire, Quartz, Silicon Germanium (SiGe), Laminates, Piezoelectric, and Glass.
Integra’s automated pick and place equipment allows for high volume processing of die into tape & reel and waffle pack and our inspection services can inspect die and wafers to Commercial, Military, Medical, and Space level specifications.