Die Prep Services from Integra

February 19, 2020

integra-die-prepDIE PREP SERVICES

Integra Technologies Silicon Valley, previously CORWIL Technologies, specializes in ultra-thin precision wafer thinning and polishing down to 25µm. 

Our Services include:

  • Wafer Thinning & Polishing
  • Wafer Dicing
  • Die Pick & Place
  • Die Inspection
  • All processes capable up to 300mm wafers

Integra has the most saw capacity of any North American subcontract manufacturer and can process virtually any material, including Silicon, Gallium Arsenide (GaAs), Indium Phosphide (InP), Sapphire, Quartz, Silicon Germanium (SiGe), Laminates, Piezoelectric, and Glass. 

Integra’s automated pick and place equipment allows for high volume processing of die into tape & reel and waffle pack and our inspection services can inspect die and wafers to Commercial, Military, Medical, and Space level specifications

Just One of Integra's Many Services.

Contact Us Today!

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Your Single Source Turnkey Solution, from Wafer Processing to Final Test with Locations Throughout the U.S.!