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Susan Campbell

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INTEGRA TECHNOLOGIES ANALYSIS LAB GRAND OPENING

Posted by Susan Campbell on Thu, Sep 02, 2021 @ 08:09 AM

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Friday was an exciting day at Integra Technologies' Wichita facility as they were joined by Congressman Ron Estes and local news media to announce the Grand Opening of their Integra Technologies Analysis Lab

The state of the art 2,700 square foot lab expansion houses 15 new pieces of specialized test equipment allowing for 150 projects to be ran per week at the new lab. Onsite DPA will give Integra the ability to reduce the time needed to complete component qualifications that directly impact time to market, allowing customers to pull in schedules to meet the nation's demand for qualified microelectronics.

Watch KSN's Live Coverage of the event:

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FULL PRESS RELEASE:

Wichita, KANS. (August 27, 2021) - Integra Technologies, a world leader in semiconductor packaging, assembly, test, characterization and related services, today announced the opening of the Integra Analysis Lab at the Integra Technologies’ headquarters in Wichita, Kansas.

 The state of the art 2,700 square foot lab expansion will house 15 new pieces of specialized test equipment allowing for 150 projects to be ran per week at the new lab. Onsite DPA will give Integra the ability to reduce the time needed to complete component qualifications that directly impact time to market, allowing customers to pull in schedules to meet the nation’s demand for qualified microelectronics.

Brett Robinson, Integra Technologies President and CEO said, “The $2 million plus capital investment furthers Integra’s commitment to support the nation’s infrastructure by providing service to the Department of Defense and space customers.”

The new Lab will bring approximately 40 engineering positions and non-technical operator positions. As DPA processes are unique to Integra in Wichita, Integra will provide onsite training to develop the expertise needed to operate the equipment and perform the analytical analyses.

Destructive Physical Analysis (DPA) is a systematic, logical and detailed analysis of electronic components during various stages of disassembly to obtain information about the quality and potential reliability concerns associated with the parts based on industry standard information and characteristics of device failures. Physical Analysis allows end users to select parts that will reliably perform as designed in their critical applications for the life of the program.

 

INTEGRA TECHNOLOGIES SILICON VALLEY ADDS NEW FLIP CHIP BONDER

Posted by Susan Campbell on Wed, Aug 18, 2021 @ 08:15 AM

865Silicon Valley, CA (Aug 18, 2021) - Integra Technologies, a world leader in semiconductor packaging, assembly, test, characterization, counterfeit detection and related services, today announced the addition of a new SEC Model 865 flip chip bonder. Designed for maximum versatility and ease of operation, the bonder’s process capabilities that support its solder and gold bumped flip chip applications include ultrasonic scrub, linear mechanical scrub, compression bonding, and flux dipping.

“We are excited to implement our new SEC bonder,,” stated Oscar Galimba, Senior Process Engineer. “The new system is very flexible and excellent for prototype and small production runs with die sizes up to 50mm square and a placement accuracy of 0.50um.”

Integra Silicon Valley has seen a large number of new flip chip programs over the past year with many more coming. Learn more about Integra’s flip chip assembly and test and qualification capabilities from their recent tutorials that can be downloaded from our web site.

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PRESS: Integra Technologies Adds V93000 SmartScale Tester

Posted by Susan Campbell on Tue, Mar 09, 2021 @ 08:45 AM

INTEGRA TECHNOLOGIES ADDS V93000 SMARTSCALE TESTER

The addition of this SmartScale Test system allows Integra to now support their customer's test needs for SmartScale testing in two locations.

Integra-V93000-SmartScale-TesterWichita, KS (March 9, 2021) - Integra Technologies, a world leader in semiconductor packaging, assembly, test, characterization and related services, today announced the addition of an advanced test system from Advantest Corp at its Wichita facility that effectively bridges the gap between ultra-high-speed digital/memory and lower end RF speeds up to 8,000 Mbps data rate. The addition of this SmartScale Test system allows Integra to now support their customer's test needs for SmartScale testing in two locations - Integra-Silicon Valley in Milpitas, CA (ISV) and Integra-Wichita, KS (ICT). Each facility can support this class of high-speed testing with multiple engineers. Furthermore, the support extends to MIL-PRF-38535 and MIL-PRF-38534 QML assembly and test to the highest DLA level of space and satellite requirements.

The V93000 SmartScale tester is populated with PS1600 and PS9G cards to provide economical test solutions up to 1600Mbps and higher with end solutions up to 8,000Mbps for the later card. Overall timing accuracy of the system is stated as +/-35ps with differential edge placement of +/-15ps. The following device types & features can now be supported with this new system:

  • DDR3 speeds to 2133Mbps & beyond   
  • DDR4 speeds to 3600Mbps
  • Future DDR5 to 3600Mbps                                       
  • High speed Serial Memories >1Gbps
  • Mobile DDRx support to 3600Mbps   
  • HS LVDS Drive & Receiver Buffers >1Gbps
  • Differential signals with precision eye placement   
  • 32 lane/multi-port PCI Express switch solutions
  • RF 12-bit ADC with 2.6 GSPS+ conversion rates   
  • RF 14-bit DAC with 2.5GSPS+ conversion rate
  • AD9215BCP ADC with10-bit accuracy at 105MSPS low offset and low power <120mW
  • AD9625 12-bit 2.6GSPS 1.3/2.5V ADC   
  • AD9739 14-bit 2.5GSPS RF DAC
  • 89HPES32HBG2 32-lane 8-port PCIe Switch with 32GBps Switching Capacity
  • AD8605/6/8 Precision Rail-to-Rail low Bbas(1pA) OP AMP with low offset voltage
  • Quadruple capacity available when multi-site testing employed with handler or hand test (4-site in parallel)
  • High speed SERDES to 8Gbps
  • DS25BR100/101 3.125Gbps LVDS Buffer w/ Transmit Pre-Emphasis & Receive Equalization

 Integra-V93000-SmartScale

Figure 1: DDR3/4 Signal integrity & ever-increasing Data Rate’s shown above ideal for the V93000 SmartScale

For high-speed serial interfaces like PCIe, Advantest SmartScale has a “SmartLoop” software option that can be used to test the protocols in loopback mode while adjusting levels, timing and jitter. SmartLoop also enables testing of high-speed signals to verify SERDES datasheet eye diagrams. This option is not part of this purchase at this time, but can be included in the future if such the capability is needed. Additionally, the SmartScale power supplies are ramp programmable which enables testing up to 12-14 bit ADC/DACs.

Integra Technologies employs multiple automated tester platforms with the largest diverse test engineering and technical degreed employee base in the USA numbering 60+ individuals. Integra supports all types of EEE devices from passives/magnetics, transistors and diodes, to high speed DDR2/3/4 SDRAM, ultra high density X24 site NAND Flash, NOR Flash, SPI EEPROM, SRAM’s, microprocessors, microcontrollers and 2000+ pin FPGA’s. With over 20+ large capacity life test/burn-in oven systems, HAST, and Temp Cycle/Thermal Shock Environmental systems, Integra offers extensive screening and qualification support for its customers. Integra’s Silicon Valley assembly operation provides package services for such packages as ceramic chip carrier/QFP and flatpack/DIP, Flip Chip, Plastic QFN’s and BGA’s. Integra’s Albuquerque facility provides full scale DPA and Failure Analysis services.

 

About Integra Technologies

Established in 1983, Integra Technologies, LLC, is a solely U.S.-based and employee owned company with DMEA accredited Category 1A Trusted. Integra is one of the largest, most experienced semiconductor die prep, assembly, test and qualification facilities in the United States with locations in Wichita, KS, Silicon Valley, CA, and Albuquerque, NM. The company’s world-class operations have been satisfying customers for over 35 years by demonstrating industry leading quality and on time delivery performance. Implemented in 2018, the Go-To-Market strategy (GTM) has positioned Integra Technologies as the leading single-source to the Aerospace and Defense, Space, semiconductor and medical customer. For more information, please visit https://www.integra-tech.com/.

Contact: Matt Bergeron, VP Business Development
Phone: 503-510-1500
Email: matt.bergeron@integra-tech.com

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INTEGRA TECHNOLOGIES EXPANDS SILICON PHOTONICS CAPABILITIES

Posted by Susan Campbell on Tue, Feb 09, 2021 @ 08:15 AM

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INTEGRA TECHNOLOGIES EXPANDS SILICON PHOTONICS CAPABILITIES

Silicon Valley, CA (Feb 9, 2021) - Integra Technologies, a world leader in semiconductor packaging, assembly, test, characterization and related services, today announced the successful implementation of a high accuracy fiber array waveguide attachment system focused on the Silicon Photonics market. This latest set of tools is based on the double-sided HexNano Alignment System from Physik Instrumente L.P. (PI).

“We’ve seen significant growth in Silicon Photonics over the last 10 years", said Jonny Corrao, Integra Technologies’ Silicon Valley General Manager. “With this growth, we have observed numerous inventive approaches and implementations of the technology, but PI’s solution is one of the most effective and practical we’ve encountered for fiber attach and general alignment.”

silicon_photonics2Shortly after the implementation, Integra was able to successfully support numerous customers and products with their fiber attach requirements. Dan Schuette, Silicon Valley Sales Manager of Physik Instrumente said, “We are pleased to have Integra become one of our partners and one of the only places in the United States to support a large number of SiPho requirements.”

Integra Technologies made the investment in this and other silicon photonics equipment to support a market that accounted for $0.8 billion in 2019 and is expected to reach $3.77 billion by 2027, growing at a CAGR of 21.4% during the forecast period. Some of the key factors propelling the growth of the market are increasing demand for high-speed broadband services, deployment of 5G technologies in developing nations, and growing demand for CMOS-integrated silicon photonics technology. Photonic devices contain optical systems that use silicon as the optical medium. Since silicon is used as a substrate for most ICs, the manufacturing of hybrid devices, in which electronic as well as optical components are integrated onto a single microchip, becomes more streamlined and standardized. Silicon photonics is increasingly used in the data transfer between microchips, through optical rays. Moreover, they are capable of carrying a large amount of data in a shorter amount of time compared to traditional electrical conductors.

 

About Integra Technologies

Established in 1983, Integra Technologies, LLC, is a solely U.S.-based and employee owned company with DMEA accredited Category 1A Trusted. Integra is one of the largest, most experienced semiconductor die prep, assembly, test and qualification facilities in the United States with locations in Wichita, KS, Silicon Valley, CA, and Albuquerque, NM. The company’s world-class operations have been satisfying customers for over 35 years by demonstrating industry leading quality and on time delivery performance. Implemented in 2018, the Go-To-Market strategy (GTM) has positioned Integra Technologies as the leading single-source to the Aerospace and Defense, Space, semiconductor and medical customer. For more information, please visit https://www.integra-tech.com/.

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Contact: Matt Bergeron, VP Business Development
Phone: 503-510-1500
Email: matt.bergeron@integra-tech.com

Have questions? Email us!

Webinar: Die Prep Processes and Overview

Posted by Susan Campbell on Tue, Nov 17, 2020 @ 08:30 AM

WEBINAR: DIE PREP PROCESSES AND OVERVIEW

WEDNESDAY, DECEMBER 2, 2020, 1:00 P.M. PST


die-prepWhile quality, functional parts are the end goal for all semiconductor companies, getting from fab to the assembly line is often an undervalued aspect of the IC supply chain. 

Wafer design and characteristics are critical for not only the final product, but also for optimizing an efficient and cost-effective production stream. Utilizing specific process methods can improve die quality and reduce unexpected downstream hiccups. 

Find out more, Wednesday, December 2, 2020, at 1:00 p.m. PST during our 'Die Prep Processes and Overview' Webinar:

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Upcoming Webinars From Integra Technologies

Posted by Susan Campbell on Thu, Oct 01, 2020 @ 02:07 PM
Sign up now for one of Integra's Webinars coming up this month:
 
By request, Integra Technologies will be offering the
'Obsolescence Management for EEE Parts' Webinar AGAIN!
Thursday, October 22nd
11:00 a.m. PST
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Advanced Packaging Overview –
Design through Assembly and Test: FlipChip and SiP Packages
 
Thursday, October 22nd
1:00 p.m. PST 
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Have Questions?
 
Contact Integra Technologies

 


Miss one of our previous webinars? Download the notes today:

webinar-integra-technologies

Mil-Std-1580 DPA Including DPAs for Copper Bond Wire PEMs

Obsolescence Management for EEE Parts - Learn more about Integra's services to support Military/Space/Aerospace companies threatened with diminishing sources of supply for semiconductor and related EEE parts

Testing of Complex FPGA's, Memory and Microprocessors - Integra has developed over 10,000 test programs including these complex devices. This webinar will explore the nuances of how such complex devices are tested.

Standards of PEM Qual and Technical Requirements Review - Integra is the leader in performing PEM (Plastic Encapsulated Microcircuits) screening, qualification and DPA for the Aerospace and Defense market.


VISIT US:

huntsville-conference

Huntsville • Redstone Arsenal Small Business Contracting Conference & Expo
Wed, Oct 21, 2020, 7:00am - 4:00pm
Von Braun Convention Center, Huntsville, AL 35801
 
 

Your Single Source Turnkey Solution, from Wafer Processing to Final Test with Locations Throughout the U.S.!

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Webinar: Mil-Std-1580 DPA

Posted by Susan Campbell on Fri, Aug 28, 2020 @ 06:39 PM
Due to popular demand we will be presenting the webinar:
Mil-Std-1580 DPA Including Copper Bond Wire PEMs
AGAIN!
Wednesday, September 9th
1:00 p.m. PST
 
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TOPICS INCLUDE:
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  • Basics of Mil Std DPA
    • Non-Destructive Testing
      • External Visual
      • Real Time X-Ray
      • XRF/Prohibited Material Inspection
      • PIND
      • Hermetic Seal
      • Acoustic Microscopy (SAM)
    • Destructive Testing
      • Mechanical/Laser Ablation/Chemical Decap
      • Internal Visual Inspection
      • Bond Pull Testing
      • Die Shear Testing
      • SEM Metallization
      • Cross Section
  • Flip Chip DPA
    • Die Shear/Ball Shear
    • Die Pull
  • BGA DPA
  • Copper Bond Wire DPA
    • Splashing
    • IMC
    • Microcracks
    • Bond Pull
  • Mil-Std-1580 Rev Changes

Presented by Rachel Garcia, DPA Lab Technical Director and Sultan Lilani, Technical Support Director at Integra Technologies

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INTEGRA TECHNOLOGIES NAMED TO THE 2020 INC. 5000 LIST

Posted by Susan Campbell on Thu, Aug 13, 2020 @ 08:15 AM

Inc. Magazine Unveils Its Annual List of America’s Fastest-Growing Private Companies—the Inc. 5000

Integra Technologies Ranks on the 2020 Inc. 5000 With Three-Year Revenue Growth of 115 Percent

NEW YORK, August 12, 2020Inc. magazine today revealed that Integra Technologies on its annual Inc. 5000 list, the most prestigious ranking of the nation’s inc5000-2020fastest-growing private companies. The list represents a unique look at the most successful companies within the American economy’s most dynamic segment—its independent small businesses. Intuit, Zappos, Under Armour, Microsoft, Patagonia, and many other well-known names gained their first national exposure as honorees on the Inc. 5000.

“Our growth says a lot about the trust our customers have put in us and the kind of work our team continues to deliver. Even through the pandemic we’ve been blessed with increasing revenue and a wonderful team that continues to execute", said Brett Robinson, Integra Technologies President and CEO.

Not only have the companies on the 2020 Inc. 5000 been very competitive within their markets, but the list as a whole shows staggering growth compared with prior lists as well. The 2020 Inc. 5000 achieved an incredible three-year average growth of over 500 percent, and a median rate of 165 percent. The Inc. 5000’s aggregate revenue was $209 billion in 2019, accounting for over 1 million jobs over the past three years.

Complete results of the Inc. 5000, including company profiles and an interactive database that can be sorted by industry, region, and other criteria, can be found at www.inc.com/inc5000. The top 500 companies are also being featured in the September issue of Inc., available on newsstands August 12.

“The companies on this year’s Inc. 5000 come from nearly every realm of business,” says Inc. editor-in-chief Scott Omelianuk. “From health and software to media and hospitality, the 2020 list proves that no matter the sector, incredible growth is based on the foundations of tenacity and opportunism.”

The annual Inc. 5000 event honoring the companies on the list will be held virtually from October 23 to 27, 2020. As always, speakers will include some of the greatest innovators and business leaders of our generation.

About Integra Technologies

Established in 1983, Integra Technologies, LLC, is a solely U.S.-based and employee owned company with DMEA accredited Category 1A Trusted. Integra is one of the largest, most experienced semiconductor die prep, assembly, test and qualification facilities in the United States with locations in Wichita, KS, Silicon Valley, CA, and Albuquerque, NM. The company’s world-class operations have been satisfying customers for over 35 years by demonstrating industry leading quality and on time delivery performance. Implemented in 2018, the Go-To-Market strategy (GTM) has positioned Integra Technologies as the leading single-source to the Aerospace and Defense, Space, semiconductor and medical customer. For more information, please visit https://www.integra-tech.com/.

Contact: Brett Robinson, President & CEO

Phone: 316-630-6805

Email: Brett.Robinson@integra-tech.com

 

More about Inc. and the Inc. 5000

Methodology

The 2020 Inc. 5000 is ranked according to percentage revenue growth when comparing 2016 and 2019. To qualify, companies must have been founded and generating revenue by March 31, 2016. They had to be U.S.-based, privately held, for profit, and independent—not subsidiaries or divisions of other companies—as of December 31, 2019. (Since then, a number of companies on the list have gone public or been acquired.) The minimum revenue required for 2016 is $100,000; the minimum for 2019 is $2 million. As always, Inc. reserves the right to decline applicants for subjective reasons. Companies on the Inc. 500 are featured in Inc.’s September issue. They represent the top tier of the Inc. 5000, which can be found at http://www.inc.com/inc5000.

 

About Inc. Media

The world’s most trusted business-media brand, Inc. offers entrepreneurs the knowledge, tools, connections, and community to build great companies. Its award-winning multiplatform content reaches more than 50 million people each month across a variety of channels including websites, newsletters, social media, podcasts, and print. Its prestigious Inc. 5000 list, produced every year since 1982, analyzes company data to recognize the fastest-growing privately held businesses in the United States. The global recognition that comes with inclusion in the 5000 gives the founders of the best businesses an opportunity to engage with an exclusive community of their peers, and the credibility that helps them drive sales and recruit talent. The associated Inc. 5000 Conference is part of a highly acclaimed portfolio of bespoke events produced by Inc. For more information, visit www.inc.com.

For more information on the Inc. 5000 Conference, visit http://conference.inc.com/.

Integra Technologies Secures $20.7 Million F-35 Contract

Posted by Susan Campbell on Tue, Jul 28, 2020 @ 08:15 AM

INTEGRA TECHNOLOGIES SECURES A $20.7 MILLION CONTRACT AWARD FROM F-35 JOINT STRIKE FIGHTER PROGRAM OFFICE


*All contract work to be done at Integra's 250 employee Wichita facility*

f35Wichita, KANS. (July 27, 2020) - Integra Technologies, a world leader in semiconductor packaging, assembly, test, characterization and related services, was awarded a $20.7 million contract from the Department of Defense’s F-35 Joint Strike Fighter Program Office. READ THE FULL RELEASE

 

Contact Integra Technologies

WEBINAR: Obsolescence Management for EEE Parts

Posted by Susan Campbell on Wed, Jul 22, 2020 @ 01:03 PM

Join Integra, Wednesday, July 29th, at 1:00 p.m. PST to learn more about the Obsolescence Managemnet for EEE Parts

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TOPICS INCLUDE:

  • Problem of Obsolescence and its impact on Aerospace and Defense companies
  • Pros and Cons of various solutions to Obsolescence
    • Board re-designs
    • Replacement of obsolete products with equivalent currently offered products
    • Board Interposers for equivalent product in different form factor
    • US based manufacturing with long term manufacturing, kitting and storage
    • Manufacture from die bank / Re-engineering
    • Broker purchase – Pros and cons
    • After market equivalent product usage on the rise
    • Re-work processes being introduced – Pros and cons and Reliability considerations
  • Supply chain aspect
    • BOM handling for long term product availability - PMP
    • Reliability risks associated with long term storage and how re-lifing can work
    • EOL prediction
    • PCN management

This FREE webinar is presented by Sultan Lilani, Technical Director at Integra Technologies and Matt Bergeron, Vice President of Business Development

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