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Webinar: Mil-Std-1580 DPA

Posted by Susan Campbell on Aug 28, 2020 6:39:51 PM
Due to popular demand we will be presenting the webinar:
Mil-Std-1580 DPA Including Copper Bond Wire PEMs
AGAIN!
Wednesday, September 9th
1:00 p.m. PST
 
register2

TOPICS INCLUDE:
webinar-integra-technologies

  • Basics of Mil Std DPA
    • Non-Destructive Testing
      • External Visual
      • Real Time X-Ray
      • XRF/Prohibited Material Inspection
      • PIND
      • Hermetic Seal
      • Acoustic Microscopy (SAM)
    • Destructive Testing
      • Mechanical/Laser Ablation/Chemical Decap
      • Internal Visual Inspection
      • Bond Pull Testing
      • Die Shear Testing
      • SEM Metallization
      • Cross Section
  • Flip Chip DPA
    • Die Shear/Ball Shear
    • Die Pull
  • BGA DPA
  • Copper Bond Wire DPA
    • Splashing
    • IMC
    • Microcracks
    • Bond Pull
  • Mil-Std-1580 Rev Changes

Presented by Rachel Garcia, DPA Lab Technical Director and Sultan Lilani, Technical Support Director at Integra Technologies

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