Thank you to all of our customers, colleagues and friends who attended our Open House on Wednesday! Visitors were able to take a tour of our newly combined assembly and test facility. The 'under one roof' location allows CORWIL to efficiently take a customer’s device from the beginning, wafer probe, to wafer prep and package assembly, perform package final test, then scan/bake/tape & reel, and into FGI or direct ship to the final end destination.
If you were not able to stop by, please give your sales rep a call and schedule a tour. You can also take a look at what CORWIL Technology can offer by checking out our video.