WEBINAR: DIE PREP PROCESSES AND OVERVIEW
WEDNESDAY, DECEMBER 2, 2020, 1:00 P.M. PST
While quality, functional parts are the end goal for all semiconductor companies, getting from fab to the assembly line is often an undervalued aspect of the IC supply chain.
Wafer design and characteristics are critical for not only the final product, but also for optimizing an efficient and cost-effective production stream. Utilizing specific process methods can improve die quality and reduce unexpected downstream hiccups.
Find out more, Wednesday, December 2, 2020, at 1:00 p.m. PST during our 'Die Prep Processes and Overview' Webinar: