IntegraBLOG

New Signs are up!

Posted by Susan Campbell on Mon, Nov 06, 2017 @ 11:19 AM

The new signs are in place at Integra Technologies! Stop by and take a look. Thank you Cordero Printing.

corwil-integra   corwil-integra

 

Request a quote

Halloween Spirit!

Posted by Susan Campbell on Tue, Oct 31, 2017 @ 04:49 PM

Enjoying Halloween at Integra today!

corwil-integra-halloween

Going Green

Posted by Susan Campbell on Wed, Oct 18, 2017 @ 08:15 AM
corwil-going-greenIntegra Technologies Silicon Valley (formerly CORWIL Technology) has partnered with Mynt Systems to take part in helping the environment by going ‘green’. Mynt Systems provided Integra with development, design, engineering and delivery of a turn-key energy efficiency and water conservation project that included efficiency upgrades to the lighting, HVAC, water process, CDA and N2 systems. The combined performance of the holistic energy and water savings project will produce a payback of 4.6 years.

“It has been our pleasure to utilize our deep understanding of energy efficiency technologies and closely held relationships with manufacturers and implementers to create a one of a kind, high yield, investment grade project for Integra and the property ownership,” said Derek Hansen of Mynt Systems. “Mynt Systems has successfully met the performance threshold set for by Integra and was excited to present a unique and groundbreaking project that benefits the all-important triple bottom line of people, planet and profit.”

“Mynt has provided us with the ability to preserve our natural resources while positively impacting bottom lines with short- and long-term cost-saving benefits,” said Matt Bergeron, GM and Vice President at Integra Silicon Valley.  Bergeron went on to say, “Mynt is projecting a 98% reuse of all the process water used in the facility. Conserving this valuable California resource along with the cost savings for Integra is a win/win situation.”

Over 1 Million CSPs Assembled

Posted by Susan Campbell on Tue, Oct 10, 2017 @ 07:30 AM

csp-corwilMILPITAS, CA, October 10, 2017 – Integra Technologies (formerly CORWIL Technology) announced today that it has successfully produced over 1 million CSP’s in its Milpitas Factory.  According to IPC’s standard J-STD-012, implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1mm.

fico1.jpgIntegra produces CSPs using its FICO vacuum assisted mold tool and uses saw singulation to extract the packages from its 70mm x 200mm panel.  “We’ve seen awide variety of product coming through the facility,” says Chip Greely Integra’s VP of Sales and Engineering, “We’ve been happy to see customers using our Assembly Guidelines (see Integra’s website for these guidlines) to make the CSP’s more manufacturable and cost effective.” 

Integra’s CSP process also includes die prep for any size wafer in production, wafer test/sort, Reliability and Package Test. “We are currently testing thousands of CSPs per quarter for one customer,” says Joe Foerstel, Integra’s VP of Test, “We are also performing device level qualification on CSP and bare die to assist our customers in ensuring product life.”

 

Request a quote

CORWIL Technology Receives Quality Management System

Posted by Susan Campbell on Wed, May 06, 2015 @ 06:43 AM
corwil-iso-certification

Milpitas, CA, May 6, 2015 - CORWIL Technology announced today their Certification to the Aerospace Quality Management System, AS9100C, after a comprehensive audit by the international certification body NSF-ISR (NSF International Strategic Registrations). This major milestone demonstrates CORWIL’s commitment to the highest standards for contract management of assembly, test and reliability services.

"This achievement allows our customers to contract with CORWIL with the utmost assurance of device test accuracy, workmanship and reliability. We continue to fulfill our customers’ requirements by providing three quality management systems certifications: ISO 9001:2008 (management systems), ISO 13485 (medical devices), and AS9100C (aerospace systems) that meet government, regulatory, military, and space communities needs in particular,” said Dhiraj Bora, CORWIL’s Vice President of Sales and Marketing.

“CORWIL continues to offer its customers the benefits of combined engineering services, assembly, testing, reliability and operational processes. This certification is an outstanding achievement in our portfolio of offerings,” added Matt Bergeron, CORWIL President and CEO.

CORWIL achieved the AS9100C certification in conjunction with continual certification to ISO 9001:2008 and ISO 13485, with upgrades to include testing, burn-in, environmental testing, reliability, end-of-line and tape & reel services.

www.corwil.com

Assembly and Test Open House Success

Posted by Susan Campbell on Sun, Mar 01, 2015 @ 10:53 PM

corwil-open-house

Thank you to all of our customers, colleagues and friends who attended our Open House on Wednesday! Visitors were able to take a tour of our newly combined assembly and test facility. The 'under one roof' location allows CORWIL to efficiently take a customer’s device from the beginning, wafer probe, to wafer prep and package assembly, perform package final test, then scan/bake/tape & reel, and into FGI or direct ship to the final end destination.  

If you were not able to stop by, please give your sales rep a call and schedule a tour. You can also take a look at what CORWIL Technology can offer by checking out our video.

CORWIL Technology Selected as Supplier of the Year by Inphi Corporation

Posted by Susan Campbell on Wed, Feb 04, 2015 @ 07:30 AM

CORWIL-Inphi_Supplier_AwardMilpitas, CA, February 4, 2015– CORWIL Technology (CORWIL), the premier US based, IC assembly and test services subcontractor, offering full back-end assembly services starting from wafer sort, thinning & dicing through die-attach, wirebond, package sealing and final test, was awarded ‘Supplier of the Year’ by Inphi Corporation (NYSE: IPHI), a leading provider of high-speed, mixed-signal semiconductor solutions for the communications, data center and computing markets.

This prestigious award is given to suppliers in recognition for performance in terms of technology, quality, manufacturing execution, and support. “CORWIL has demonstrated leadership among our suppliers in 2014 through superior execution across these metrics,” said Dr. Ron Torten, Senior Vice President of Operations and IT at Inphi.

“We are honored to be recognized by Inphi as their supplier of the year. It is a tribute to our team who has spent considerable time and effort working with Inphi in support of their ‘fast data and fast growth’ products,” said Matt Bergeron, CORWIL Technology President and CEO. “We are committed to working collaboratively to meet our customers' needs and this shows that strong customer service can make a real difference.”

 

CORWIL_Inphi_Supplier_Award 
CORWIL Technologies’ Inphi team celebrates winning the award

 

 

About CORWIL Technology Corporation

CORWIL Technology provides high quality and responsive semiconductor assembly and test services focusing on Hi-Rel, fast-turn and wafer processing markets. Founded in 1990 and based in Milpitas, CA, CORWIL is the premier U.S. provider of full back-end assembly services and is a key partner with leading medical, Mil/Aero and commercial semiconductor companies.

For more information about CORWIL, please visit www.corwil.com.

 

About Inphi

Inphi Corporation is a leading provider of high-speed, mixed signal semiconductor solutions for the communications, data center and computing markets. Inphi’s end-to-end data transport platform delivers high signal integrity at leading-edge data speeds, addressing performance and bandwidth bottlenecks in networks, from fiber to memory. Inphi’s solutions minimize latency in computing environments and enable the rollout of next-generation communications infrastructure. Inphi’s solutions provide a vital interface between analog signals and digital information in high-performance systems, such as telecommunications transport systems, enterprise networking equipment, enterprise and data center servers, and storage platforms. To learn more about Inphi, visit www.inphi.com.

Inphi, the Inphi logo and Think fast are registered trademarks of Inphi Corporation. All other trademarks used herein are the property of their respective owners.