No Re-Balling Required with Integra’s On-shore Plastic BGA Assembly Capabilities
We offer open-tooling (JEDEC Standards) CSBGA (CSBGA (CHIP SCALE BGA) at our Milpitas, Calif facility- Body sizes: Virtually Unlimited
- Mold caps: 0.60, 0.80, 1.0 1.25mm
- Total profiles vary by substrate
- Ball pitch: 0.40mm & Larger
- We attach the tin/lead solder during the assembly process on our BGA packages. No re-balling or re-work needed; one reflow process
- Meets the requirements for Commercial, Industrial, Medical and Aerospace customers
- If custom BGA package is required, please contact us. We will tool custom plastic BGAs with reasonable development NREs
Our engineering team works with customers to help identify and solve existing and potential IC packaging issues, sparing customers from costly packaging delays and potential failures due to rework. We will develop manufacturable package solutions for next-generation, high-volume production. Integra Technologies has the experience to meet your most demanding advanced packaging challenges including SiP, MCM, RF Modules and Stacked assemblies.
Tin/Lead Solder Balls for your BGAs from the get-go; look no further than Integra Technologies, Silicon Valley
