IntegraBLOG

CORWIL Technology Receives Trusted Accreditation

Posted by Susan Campbell on Wed, Oct 19, 2016 @ 07:53 AM
Milpitas, CA, October 19, 2016 – CORWIL Technology (CORWIL), headquartered in Milpitas, CA, has received Trusted Accreditation by the Defense Microelectronics Activity (DMEA) as a Microelectronics Trusted Source for the Department of Defense (DoD) and all other U.S. Government customers. This Trusted Accreditation award includes Microelectronics Packaging, Back Grinding (Post Processing) and Assembly.

corwil-trusted-accreditationCORWIL has served the DoD, U.S. Government agencies and major prime contractors in providing state-of-the-art microelectronics packaging services with military and aerospace reliability. DMEA serves as a technology partner to military program managers and engineering liaison to all sectors of the defense contractors to provide and support the most effective microelectronics technologies available through the commercial sector.

“The Trusted Partner Accreditation is yet another key milestone in our business strategy to further our commitment in quality services and processes for the military and aerospace sector,” said Matt Bergeron, CORWIL Technology President. “CORWIL is honored to be one of the few companies offering Trusted Microelectronics Packaging, Back Grinding (Post Processing) and Assembly.”

Certificate: Defense Microelectronics Activity (DMEA) Accreditation of Trust

 

CORWIL Technology Selected as Supplier of the Year by Inphi Corporation

Posted by Susan Campbell on Wed, Feb 04, 2015 @ 07:30 AM

CORWIL-Inphi_Supplier_AwardMilpitas, CA, February 4, 2015– CORWIL Technology (CORWIL), the premier US based, IC assembly and test services subcontractor, offering full back-end assembly services starting from wafer sort, thinning & dicing through die-attach, wirebond, package sealing and final test, was awarded ‘Supplier of the Year’ by Inphi Corporation (NYSE: IPHI), a leading provider of high-speed, mixed-signal semiconductor solutions for the communications, data center and computing markets.

This prestigious award is given to suppliers in recognition for performance in terms of technology, quality, manufacturing execution, and support. “CORWIL has demonstrated leadership among our suppliers in 2014 through superior execution across these metrics,” said Dr. Ron Torten, Senior Vice President of Operations and IT at Inphi.

“We are honored to be recognized by Inphi as their supplier of the year. It is a tribute to our team who has spent considerable time and effort working with Inphi in support of their ‘fast data and fast growth’ products,” said Matt Bergeron, CORWIL Technology President and CEO. “We are committed to working collaboratively to meet our customers' needs and this shows that strong customer service can make a real difference.”

 

CORWIL_Inphi_Supplier_Award 
CORWIL Technologies’ Inphi team celebrates winning the award

 

 

About CORWIL Technology Corporation

CORWIL Technology provides high quality and responsive semiconductor assembly and test services focusing on Hi-Rel, fast-turn and wafer processing markets. Founded in 1990 and based in Milpitas, CA, CORWIL is the premier U.S. provider of full back-end assembly services and is a key partner with leading medical, Mil/Aero and commercial semiconductor companies.

For more information about CORWIL, please visit www.corwil.com.

 

About Inphi

Inphi Corporation is a leading provider of high-speed, mixed signal semiconductor solutions for the communications, data center and computing markets. Inphi’s end-to-end data transport platform delivers high signal integrity at leading-edge data speeds, addressing performance and bandwidth bottlenecks in networks, from fiber to memory. Inphi’s solutions minimize latency in computing environments and enable the rollout of next-generation communications infrastructure. Inphi’s solutions provide a vital interface between analog signals and digital information in high-performance systems, such as telecommunications transport systems, enterprise networking equipment, enterprise and data center servers, and storage platforms. To learn more about Inphi, visit www.inphi.com.

Inphi, the Inphi logo and Think fast are registered trademarks of Inphi Corporation. All other trademarks used herein are the property of their respective owners.

 

CORWIL Technology Combines Assembly and Test in One Location

Posted by Susan Campbell on Wed, Dec 17, 2014 @ 07:21 PM

Milpitas, CA, December 18, 2014 - CORWIL Technology now offers assembly and test services to their customers all under one roof. CORWIL announces the completion of the CORWIL Test Division (CTD) move from their Santa Clara location to the newly remodeled CORWIL facility located at 1635 McCarthy Boulevard, Milpitas, CA. The building redesign includes the addition of 21,500 sq ft to house the CTD equipment which includes ATE such as Teradyne UltraFlex and Advantest 93K, Seiko Epson Handlers, Accretech & TEL Wafer Probers, Burn-in testing equipment and End-of-Line equipment such as scan, laser mark, tape and reel.

The newly remolded building allows customers full access to the CORWIL engineering team at one location and helps to minimize overhead and logistics allowing CORWIL to offer competitive prices for manufacturing services in Silicon Valley.“The decision to combine the two businesses in one building was an easy one,” says Matt Bergeron, CORWIL CEO. “This move will allow our customers easier access to a full turnkey solution. They can watch their product move from assembly to test, reducing their time to market and easing logistical concerns.”

Joe Foerstel, CORWIL Test Division General Manager, said “Being in one location allows CORWIL to efficiently take a customer’s device from the beginning at wafer probe, move on to wafer prep and package assembly, perform package final test, then scan/bake/tape & reel, and into FGI or direct ship to the final end destination.  The new facility also allows CORWIL to offer more on the package/device reliability arena with the ability to perform MLS moisture pre-conditioning and then reflow all onsite, to enhance the current offerings of HTOL, LTOL, THB, HAST, and Temp. Cycling.  CORWIL can do it all, or only what the customer requires from wafer probe to shipping the final tested package.”

 CORWIL Technology

 

About CORWIL Technology Corporation

CORWIL Technology provides high quality and responsive semiconductor assembly and test services focusing on Hi-Rel, fast-turn and wafer processing markets. Founded in 1990 and based in Milpitas, CA, CORWIL is the premier U.S. provider of full back-end assembly services and is a key partner with leading medical, Mil/Aero and commercial semiconductor companies. For more information about CORWIL, please visit www.corwil.com.

 

Die-Prep Considerations for IC Device Applications

Posted by Susan Campbell on Wed, Oct 29, 2014 @ 07:16 AM

MEPTECEarlier this month, CORWIL's own Jonny Corrao, Engineering Manager, presented 'Die-Prep Considerations for IC Device Applications,' at the October MEPTEC Luncheon at the Biltmore Hotel in Santa Clara, CA.

Thank you for coming for all of those who attended. If you weren't able to make the luncheon please download the presentation below.

Die-Prep Considerations for IC Device Applications (.pdf)

  • Final thickness, surface finish, edge & backside quality, application demands… one wafer, yet endless combinations of process options when working to achieve the highest quality dice possible, prior to IC assembly. This presentation explores various device applications, with consideration to technology node, wafer size, wafer material(s), interconnect, reliability criteria, packing method, and assembly requirements, in concert with die-prep disciplines spanning wafer thinning, singulation, die-sort (pick & place or “plating”), and inspection methods.

Please contact CORWIL with any question you have regarding the presentation or any of CORWIL's services - info@corwil.com