Integra Technologies is excited to announce the addition of Laser Grooving to their long line of product offerings
Laser grooving is a versatile and precise machining technique essential for various processes in semiconductor fabrication, including wafer dicing, microelectronic device fabrication, thin-film deposition, and photonics/optoelectronics. Its ability to create clean and precise grooves on semiconductor substrates makes it a critical tool for advancing semiconductor technology and manufacturing capabilities.
Laser Grooving Provides:
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High Precision: laser grooving offers exceptional precision and accuracy, allowing for the creation of intricate features and patterns on semiconductor substrates.
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Speed and Efficiency: laser grooving can be performed at high speeds, making it suitable for high-volume production environments in semiconductor manufacturing.
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Non-contact Process: Since laser grooving is a non-contact process, it minimizes the risk of mechanical damage, contamination, and material defects.
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Versatility: laser grooving is compatible with a wide range of semiconductor materials, including silicon, gallium arsenide (GaAs), indium phosphide (InP), and other compound semiconductors.
Integra has chosen the Accretech AL3000, fully automated laser grooving machine to meet the needs of their customers. The AL3000 provides:
- Achieves both high quality processing and high throughput with a unique laser engine mechanism
With the conventional laser grooving process, establishing both high-quality processing as well as throughput is difficult, so there is a trade-off relationship.
A high-quality, high throughput laser grooving process is provided in which the trade-off has been eliminated through the combination of our original laser engine mechanism + the high-rigidity platform.
- Φ 300 mm wafer compatible, fully automatic laser grooving machine
Automatically supports a series of processes from water-soluble protective film distribution to laser dicing and cleaning.
- Supports a laser grooving process
The optical design is ideal for low-k grouping and removal of TEG from above the street.
Processing distortion and damage due to heat are kept to a minimum, and a stable processing groove is formed.
*Photo: Accretech
Review the full datasheet
The Integra sales team is looking forward to discussing how the new laser grooving services can benefit your upcoming project. Contact us today, sales_inquiry@integra-tech.com or Request a Quote.