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CORWIL Technology Receives Trusted Accreditation

Posted by Susan Campbell on Wed, Oct 19, 2016 @ 07:53 AM
Milpitas, CA, October 19, 2016 – CORWIL Technology (CORWIL), headquartered in Milpitas, CA, has received Trusted Accreditation by the Defense Microelectronics Activity (DMEA) as a Microelectronics Trusted Source for the Department of Defense (DoD) and all other U.S. Government customers. This Trusted Accreditation award includes Microelectronics Packaging, Back Grinding (Post Processing) and Assembly.

corwil-trusted-accreditationCORWIL has served the DoD, U.S. Government agencies and major prime contractors in providing state-of-the-art microelectronics packaging services with military and aerospace reliability. DMEA serves as a technology partner to military program managers and engineering liaison to all sectors of the defense contractors to provide and support the most effective microelectronics technologies available through the commercial sector.

“The Trusted Partner Accreditation is yet another key milestone in our business strategy to further our commitment in quality services and processes for the military and aerospace sector,” said Matt Bergeron, CORWIL Technology President. “CORWIL is honored to be one of the few companies offering Trusted Microelectronics Packaging, Back Grinding (Post Processing) and Assembly.”

Certificate: Defense Microelectronics Activity (DMEA) Accreditation of Trust

 

Assembly and Test Open House Success

Posted by Susan Campbell on Sun, Mar 01, 2015 @ 10:53 PM

corwil-open-house

Thank you to all of our customers, colleagues and friends who attended our Open House on Wednesday! Visitors were able to take a tour of our newly combined assembly and test facility. The 'under one roof' location allows CORWIL to efficiently take a customer’s device from the beginning, wafer probe, to wafer prep and package assembly, perform package final test, then scan/bake/tape & reel, and into FGI or direct ship to the final end destination.  

If you were not able to stop by, please give your sales rep a call and schedule a tour. You can also take a look at what CORWIL Technology can offer by checking out our video.

CORWIL Technology Combines Assembly and Test in One Location

Posted by Susan Campbell on Wed, Dec 17, 2014 @ 07:21 PM

Milpitas, CA, December 18, 2014 - CORWIL Technology now offers assembly and test services to their customers all under one roof. CORWIL announces the completion of the CORWIL Test Division (CTD) move from their Santa Clara location to the newly remodeled CORWIL facility located at 1635 McCarthy Boulevard, Milpitas, CA. The building redesign includes the addition of 21,500 sq ft to house the CTD equipment which includes ATE such as Teradyne UltraFlex and Advantest 93K, Seiko Epson Handlers, Accretech & TEL Wafer Probers, Burn-in testing equipment and End-of-Line equipment such as scan, laser mark, tape and reel.

The newly remolded building allows customers full access to the CORWIL engineering team at one location and helps to minimize overhead and logistics allowing CORWIL to offer competitive prices for manufacturing services in Silicon Valley.“The decision to combine the two businesses in one building was an easy one,” says Matt Bergeron, CORWIL CEO. “This move will allow our customers easier access to a full turnkey solution. They can watch their product move from assembly to test, reducing their time to market and easing logistical concerns.”

Joe Foerstel, CORWIL Test Division General Manager, said “Being in one location allows CORWIL to efficiently take a customer’s device from the beginning at wafer probe, move on to wafer prep and package assembly, perform package final test, then scan/bake/tape & reel, and into FGI or direct ship to the final end destination.  The new facility also allows CORWIL to offer more on the package/device reliability arena with the ability to perform MLS moisture pre-conditioning and then reflow all onsite, to enhance the current offerings of HTOL, LTOL, THB, HAST, and Temp. Cycling.  CORWIL can do it all, or only what the customer requires from wafer probe to shipping the final tested package.”

 CORWIL Technology

 

About CORWIL Technology Corporation

CORWIL Technology provides high quality and responsive semiconductor assembly and test services focusing on Hi-Rel, fast-turn and wafer processing markets. Founded in 1990 and based in Milpitas, CA, CORWIL is the premier U.S. provider of full back-end assembly services and is a key partner with leading medical, Mil/Aero and commercial semiconductor companies. For more information about CORWIL, please visit www.corwil.com.