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Webinar: Mil-Std-1580 DPA

Posted by Susan Campbell on Fri, Aug 28, 2020 @ 06:39 PM
Due to popular demand we will be presenting the webinar:
Mil-Std-1580 DPA Including Copper Bond Wire PEMs
AGAIN!
Wednesday, September 9th
1:00 p.m. PST
 
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TOPICS INCLUDE:
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  • Basics of Mil Std DPA
    • Non-Destructive Testing
      • External Visual
      • Real Time X-Ray
      • XRF/Prohibited Material Inspection
      • PIND
      • Hermetic Seal
      • Acoustic Microscopy (SAM)
    • Destructive Testing
      • Mechanical/Laser Ablation/Chemical Decap
      • Internal Visual Inspection
      • Bond Pull Testing
      • Die Shear Testing
      • SEM Metallization
      • Cross Section
  • Flip Chip DPA
    • Die Shear/Ball Shear
    • Die Pull
  • BGA DPA
  • Copper Bond Wire DPA
    • Splashing
    • IMC
    • Microcracks
    • Bond Pull
  • Mil-Std-1580 Rev Changes

Presented by Rachel Garcia, DPA Lab Technical Director and Sultan Lilani, Technical Support Director at Integra Technologies

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Obsolete Parts Management with Integra Technologies

Posted by Susan Campbell on Tue, May 19, 2020 @ 09:15 AM

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Integra’s Parts Management Program (PMP) started in 1991, actively managing multiple Aerospace and Defense companies’ parts procurement program with value added services.

We specialize in Obsolescence Management Solutions including:

  • Obsolescence sustaining team resources
  • Buy product from franchised distributors or device manufacturer direct with value added services (upscreening, qualification, tape/reel, managed solder dipping, dry-pack etc.)
  • Inventory management and kitting
  • Forecast management
  • Form Fit Function replacement
    • In-house package assemblyobsolete-integra
    • Re-design solution
    • Interposer
  • Die procurement and assembly with QML assembly partners
  • Buy EOL product and manage customer owned inventory
    • Short and long term inventory management
  • PCN/EOL – Integra supports this through our PMP program. 
    • We work with franchised distribution and have access to their PCN/EOL surveys.  We manage this information and communicate to customers as required
  • After market procurement of devices with extensive counterfeit mitigation testing
    • Risk based tiered authenticity testing (AS6171, AS6081)
    • Physical failure analysis (layer-by-layer analysis, SEM, SAM, Leak testing)
    • Screening and qualification on a lot-by-lot basis

Contact Integra Technologies

 

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CORWIL TECHNOLOGY TEST, RELIABILTY AND EOL SERVICES

Posted by Susan Campbell on Wed, Mar 11, 2015 @ 08:04 AM

Milpitas, CA, March 11, 2015 - CORWIL Technology has fully integrated Test, Reliability and EOL services along with wafer preparation and wafer assembly offerings.

  • corwil-chroma-3650Wafer Sort and Package Test:  CORWIL has the capability to test Digital, Memory, Mixed Signal, ASIC, SoC and RF type devices.  Current RF test capabilities are up to 6GHz with multiple ports through the Catalyst RF platforms, or the MVNA on the ASL3000.  CORWIL is actively working toward enabling in house RF testing up to 40 GHz for measuring S parameters and eye diagrams.  A new addition to the current Digital test suite of 93K SOC, J750 and UltraFlex platforms is the Chroma 3650 tester, now running a steady stream of devices multi-site for a long term customer.  
  • Automated Probe:  CORWIL has Accretech, TEL and Semics, with tri-temp up to 200mm and ambient/hot for 300mm.  Besides docking to the commercial ATE platforms at CORWIL, like the Catalyst, Quartet or J750, CORWIL has run several projects that required docking to consigned custom test systems for wafer sort of image sensors. 
  • Reliability and Burn-In: CORWIL’s Reliability and Burn-In area has multiple chambers for THB, HAST, LTOL, HTOL, Temperature Cycling and Thermal shock.  CORWIL has the capability of doing large system boards in all of these chambers as well.
  • EOL: An RVSI has recently been installed to enhance the lead and ball scan capabilities.  The ink marking complements the laser marking also offered before units go to the tape and reel, dry packing and if needed FGI for later drop ship.
  • Hardware and Test Development:  CORWIL can assist customers in selecting and procuring sockets, boards and other test hardware for Test and Reliability services as well as assist in the development of Test programs.

With the integration complete, CORWIL can now offer all of the services to make it the only fully integrated onshore OSAT in the Silicon Valley. For more information visit www.corwil.com

 

 

About CORWIL Technology Corporation

CORWIL Technology provides high quality and responsive semiconductor assembly and test services focusing on Hi-Rel, fast-turn and wafer processing markets. Founded in 1990 and based in Milpitas, CA, CORWIL is the premier U.S. provider of full back-end assembly services and is a key partner with leading medical, Mil/Aero and commercial semiconductor companies. For more information about CORWIL, please visit www.corwil.com.