Upcoming Webinars From Integra Technologies

Posted by Susan Campbell on Thu, Oct 01, 2020 @ 02:07 PM
Sign up now for one of Integra's Webinars coming up this month:
By request, Integra Technologies will be offering the
'Obsolescence Management for EEE Parts' Webinar AGAIN!
Thursday, October 22nd
11:00 a.m. PST

Advanced Packaging Overview –
Design through Assembly and Test: FlipChip and SiP Packages
Thursday, October 22nd
1:00 p.m. PST 

Have Questions?
Contact Integra Technologies


Miss one of our previous webinars? Download the notes today:


Mil-Std-1580 DPA Including DPAs for Copper Bond Wire PEMs

Obsolescence Management for EEE Parts - Learn more about Integra's services to support Military/Space/Aerospace companies threatened with diminishing sources of supply for semiconductor and related EEE parts

Testing of Complex FPGA's, Memory and Microprocessors - Integra has developed over 10,000 test programs including these complex devices. This webinar will explore the nuances of how such complex devices are tested.

Standards of PEM Qual and Technical Requirements Review - Integra is the leader in performing PEM (Plastic Encapsulated Microcircuits) screening, qualification and DPA for the Aerospace and Defense market.



Huntsville • Redstone Arsenal Small Business Contracting Conference & Expo
Wed, Oct 21, 2020, 7:00am - 4:00pm
Von Braun Convention Center, Huntsville, AL 35801

Your Single Source Turnkey Solution, from Wafer Processing to Final Test with Locations Throughout the U.S.!



Over 1 Million CSPs Assembled

Posted by Susan Campbell on Tue, Oct 10, 2017 @ 07:30 AM

csp-corwilMILPITAS, CA, October 10, 2017 – Integra Technologies (formerly CORWIL Technology) announced today that it has successfully produced over 1 million CSP’s in its Milpitas Factory.  According to IPC’s standard J-STD-012, implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1mm.

fico1.jpgIntegra produces CSPs using its FICO vacuum assisted mold tool and uses saw singulation to extract the packages from its 70mm x 200mm panel.  “We’ve seen awide variety of product coming through the facility,” says Chip Greely Integra’s VP of Sales and Engineering, “We’ve been happy to see customers using our Assembly Guidelines (see Integra’s website for these guidlines) to make the CSP’s more manufacturable and cost effective.” 

Integra’s CSP process also includes die prep for any size wafer in production, wafer test/sort, Reliability and Package Test. “We are currently testing thousands of CSPs per quarter for one customer,” says Joe Foerstel, Integra’s VP of Test, “We are also performing device level qualification on CSP and bare die to assist our customers in ensuring product life.”


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CORWIL Focuses on MedTech Industries

Posted by Susan Campbell on Mon, Aug 11, 2014 @ 02:42 PM

CORWIL Medical

CORWIL Technology is a U.S. based OSAT with a unique focus on Medical Device and Biotech industries. Our Bay Area facilities are state of the art, and boast an unparalleled range of high-end equipment and capabilities in both assembly and test disciplines, that when tagged with CORWIL’s highly skilled and experienced engineering team and ISO 13485:2003 certification, make CORWIL the ideal NPI and production partner for leading-edge Med-Tech applications such as DNA Sequencing, ICD/Pacemaker, Neuromodulation, Medical Imaging, and more. 

One of the biggest differentiators between CORWIL and other domestic subcontractors is our significant investment in back-end wafer processing – CORWIL has more wafer thinning, dicing, inspection, and die-sort capacity than any other OSAT in North America, and is positioned to support both high-mix/low-volume, as well as mid to high-volume die-prep requirements, from individual die, all the way through 300mm wafer sizes. CORWIL also has vast experience in exotic material processing such as AlN, GaN, GaAs, InP, SiC, and Sapphire. 

In our Class 1000 and 10000 cleanrooms, CORWIL's services include:

  • Wafer Thinning & Polishing
    • 300 mm wafer
  • Wafer Dicing
    • Largest array of dicing saws stateside
    • Multi-project wafers
  • Assembly
    • Wirebond
    • Flip Chip
  • Encapsulation
    • Flow cell attach
    • Custom dam & fill configurations
  • Plastic Molding
  • Environmental Test
  • Mechanical Test
  • Electrical Test

optical inspectionCORWIL’s wafer and die inspection capabilities comprise of advanced AOI systems (Automated Optical Inspection), as well as highly skilled technicians trained and experienced to MIL-STD-883, Class Levels Q & V, with DLA certification to MIL-PRF-38535. Our assembly portfolio spans a wide range of JEDEC and custom package types such as ceramic (hermetic and non-hermetic), plastic QFN/DFN, BGA, LGA, CSP, COB, and MCM, with numerous material options in die-attach, interconnect, and seal. CORWIL also offers a wide range of test services, including environmental, mechanical, and electrical, with an ATE portfolio spanning analog, digital, mixed-signal, and RF, complete with probers and handlers to support both wafer-sort and package-test. 

CORWIL is QML listed (levels Q&V), ISO 9001:2008, ISO 13485:2003, and is ITAR registered and compliant.


ISO Certification

CORWIL Increases Die Attach Capacity with a New MAT 6400

Posted by Susan Campbell on Mon, Mar 31, 2014 @ 07:50 AM

Milpitas, CA, March 31, 2014 – CORWIL Technology (CORWIL) announces continued invest ment in capabilities with the addition of a new MAT 6400 for automated die attach.

MAT 6400Improving quality and reliability is a basic tenet of CORWIL Technology’s focus on superior customer service and meeting today’s exacting quality demands in assembly. To this end CORWIL has added a new MAT 6400 die attach system from MicroAssembly Technologies. This equipment acquisition adds capability and improves quality in the assembly operations.

Die attach is the foundation of the assembly process; it is the first critical step in the
process and getting it right is essential for a reliable finished product. The MAT 6400 die attach system helps achieve the goal of a solid foundation by using a high resolution digital vision system to ensure a pick and placement accuracy of 3 um @ 3 sigma (Application dependent). The fully automated system is designed for flexibility and improved quality.

The MAT 6400’s handling equipment can pick die from a variety of sources including waffle/Gelpacks, tape and reel feeders giving customers flexibility in their sourcing options.  The flexible tooling allows CORWIL to process active and passive components in sizes ranging from 0.2mm to 25mm. In addition the tooling is capable of handling unusual die sizes and aspect ratios associated with CCD’s, sensors and sensitive MEMS devices and ensure accurate BLT (Bond Line Thickness) control.

A number of die attach methods are available including:

  • Epoxy or Silver Glass
  • Eutectic
  • Thermo-compression

Features include:

  • The flexibility of the adhesive dispensing system allows single and multi dot patterns to be applied from a library of dispense patterns or the
    development of custom patterns for a specific project/customer application. The pin transfer process, stamping, has the capability of applying adhesive dots 75 micron and under.
  • Flip chip processing is easily handled with inline bump fluxing as well as over and up looking cameras to ensure accurate chip placement and alignment.
  • Heating of the substrate and tools are available to ensure the quality of the eutectic and thermo compression bonding processes.
  • Die stacking is another advanced feature of this equipment.

Richard Tung, CORWIL’s VP of Operations added “The MAT 6400 increases our capabilities in the handling of die from a variety of sources and the processing of thin and/or fragile die and devices including MEM’s LCD’s and sensors. The different die attach methods allow us to offer customers a variety solutions to meet their quality and delivery needs for prototype or production volumes in a timely fashion.”

“The integration of this capability, coupled with other recent equipment additions, adds to our
flexibility, accuracy and increased capacity and through put,” stated Matt Bergeron, CORWIL Technology’s President and CEO. “This capital investment continues our commitment to build CORWIL’s capabilities to service the Mil/Aero and medical customers who demand a secure, on-shore, fully qualified and certified facility for processing and handling of their die. The increased capacity is a demonstration of our commitment to be the leading independent assembly and test facility for all our customers.”


About CORWIL Technology Corporation

CORWIL Technology provides high quality and responsive semiconductor assembly and test services focusing on Hi-Rel, fast-turn and wafer processing markets. Founded in 1990 and based in Milpitas, CA, CORWIL is the premier U.S. provider of full back-end assembly services and is a key partner with leading medical, Mil/Aero and commercial semiconductor companies.

For more information about CORWIL, please visit