flip chip

Integra Technologies Adds FC150 Automated Die / Flip Chip Bonder

With Heterogeneous Integration and finer flip chip pitches becoming a reality, Integra Technologies recently added a FC150 Automated

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KEEPING IT IN THE U.S.

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Upcoming Webinars From Integra Technologies

Sign up now for one of Integra's Webinars coming up this month: By request, Integra Technologies will be offering the

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Over 1 Million CSPs Assembled

MILPITAS, CA, October 10, 2017 – Integra Technologies (formerly CORWIL Technology) announced today that it has successfully produced over 1

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CORWIL Focuses on MedTech Industries

CORWIL Technology is a U.S. based OSAT with a unique focus on Medical Device and Biotech industries. Our Bay Area facilities are state of

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CORWIL Increases Die Attach Capacity with a New MAT 6400

Milpitas, CA, March 31, 2014 – CORWIL Technology (CORWIL) announces continued invest ment in capabilities with the addition of a new MAT

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