flip chip
Integra Technologies Adds FC150 Automated Die / Flip Chip Bonder
With Heterogeneous Integration and finer flip chip pitches becoming a reality, Integra Technologies recently added a FC150 Automated
Upcoming Webinars From Integra Technologies
Sign up now for one of Integra's Webinars coming up this month: By request, Integra Technologies will be offering the
Over 1 Million CSPs Assembled
MILPITAS, CA, October 10, 2017 – Integra Technologies (formerly CORWIL Technology) announced today that it has successfully produced over 1
CORWIL Focuses on MedTech Industries
CORWIL Technology is a U.S. based OSAT with a unique focus on Medical Device and Biotech industries. Our Bay Area facilities are state of
CORWIL Increases Die Attach Capacity with a New MAT 6400
Milpitas, CA, March 31, 2014 – CORWIL Technology (CORWIL) announces continued invest ment in capabilities with the addition of a new MAT