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INTEGRA TECHNOLOGIES ANALYSIS LAB GRAND OPENING

Posted by Susan Campbell on Thu, Sep 02, 2021 @ 08:09 AM

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Friday was an exciting day at Integra Technologies' Wichita facility as they were joined by Congressman Ron Estes and local news media to announce the Grand Opening of their Integra Technologies Analysis Lab

The state of the art 2,700 square foot lab expansion houses 15 new pieces of specialized test equipment allowing for 150 projects to be ran per week at the new lab. Onsite DPA will give Integra the ability to reduce the time needed to complete component qualifications that directly impact time to market, allowing customers to pull in schedules to meet the nation's demand for qualified microelectronics.

Watch KSN's Live Coverage of the event:

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FULL PRESS RELEASE:

Wichita, KANS. (August 27, 2021) - Integra Technologies, a world leader in semiconductor packaging, assembly, test, characterization and related services, today announced the opening of the Integra Analysis Lab at the Integra Technologies’ headquarters in Wichita, Kansas.

 The state of the art 2,700 square foot lab expansion will house 15 new pieces of specialized test equipment allowing for 150 projects to be ran per week at the new lab. Onsite DPA will give Integra the ability to reduce the time needed to complete component qualifications that directly impact time to market, allowing customers to pull in schedules to meet the nation’s demand for qualified microelectronics.

Brett Robinson, Integra Technologies President and CEO said, “The $2 million plus capital investment furthers Integra’s commitment to support the nation’s infrastructure by providing service to the Department of Defense and space customers.”

The new Lab will bring approximately 40 engineering positions and non-technical operator positions. As DPA processes are unique to Integra in Wichita, Integra will provide onsite training to develop the expertise needed to operate the equipment and perform the analytical analyses.

Destructive Physical Analysis (DPA) is a systematic, logical and detailed analysis of electronic components during various stages of disassembly to obtain information about the quality and potential reliability concerns associated with the parts based on industry standard information and characteristics of device failures. Physical Analysis allows end users to select parts that will reliably perform as designed in their critical applications for the life of the program.

 

ISTFA - Portland, Going on Now!

Posted by Susan Campbell on Wed, Nov 13, 2019 @ 12:58 PM

Integra-ISTFA-2019Stop by Booth #203 at ISTFA at the Portland Convention Center today and tomorrow to say 'Hi' to Sultan and Mark! Let them help you with your Failure analysis and Analytical Service Needs!

Not able to make the show? Contact our sales group today sales_inquiry@integra-tech.com. They are looking forward to hearing from you.

-55°C Electrical Testing from Integra

Posted by Susan Campbell on Wed, Sep 26, 2018 @ 09:32 AM

thermostream1Integra Technologies uses its advanced automated test equipment (ATE) for the purpose of testing at -55°C and beyond. In support of extended temperature testing, we have 35+ ATEs to support the test program development and testing of EEE components. Our successful track record for software development and electrical testing is largely due to:

  • Extensive experience in characterizing  and testing  EEE devices at -55°C and below. This includes Discrete, Passives, Linear, Memory, FPGA, SERDES, Microcontrollers, A/D, D/A, Connectors, Relays, Inductors and Magnetics.
  • Utilizing the largest on-site Test Engineering team, among all test labs worldwide, to develop software and hardware for the extended temperature testing and characterization
  • Integra’s -55°C test strategy includes using one of  our many precision ‘Thermal Temperature Forcing’ units in conjunction with our advanced ATEs. Our  temperature forcing units are testing from -75°C to +200°C.
  • Our custom DUT (Device Under Test)  temperature monitoring process includes
    • Continuous monitoring of temperature at the DUT level for compliance to maintain the target temperature. 
    • Temperature guard-band to account for temperature gradient across the measurement area
    • Calculated temperature ramp rates and soak times to achieve junction temperatureequilibrium using actual packaged devices
    • Precision temperature monitoring thermocouples used to insure highest integrity of test temperature assurance to specification
    • Controlled anti-ESD environment within the Thermal Temperature Forcing units
  • Our cold temperature process has been audited by DLA for compliance
  • High volume cold temperature testing using cold temperature handlers
  • We test both packaged and wafer level cold temperature testing
  • Thousands of lots of historical data running -55°C testing
  • Extensive work with cold temperature storage or cold temperature life test followed by cold temperature electrical testing

 Interested in Learning More? Contact Integra Today!

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Your Single Source Turnkey Solution, from Wafer Processing to Final Test with our Locations Throughout the U.S.!