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Testing of Complex FPGAs, Memory and Microprocessors

Posted by Susan Campbell on Thu, Jun 11, 2020 @ 11:06 AM

fpga-image-integra

webinarElectrical testing of semiconductors to datasheet is a very complex process. The testing process requires development of test algorithms and patters specific to device performance, application and functionality. The process requires advanced Automated Test Equipment (ATE), experienced product, test / hardware engineers and knowledge of the devices to be tested. Memory, FPGAs and Microcontrollers all have different test protocols and product specifications.

For example, some of the structures of a Microcontroller are comparable to a simple computer placed in a single chip with all of the necessary components like memory and timers embedded inside. Likewise; the structure of a FPGA typically has multiple structures with the silicon and requires in-depth knowledge of how such structures work. Patterns and configuration files need to be created to exercise such FPGAs.

Integra has developed over 10,000 test programs including these complex devices. This Webinar will explore the nuances of how such complex devices are tested.

Wednesday, June 24, 1:00 p.m. PST


Testing of Complex FPGAs, Memory and Microprocessors

  • Microprocessors
    • What does AC/DC and Functional Testing Mean for a Typical Microprocessor?
    • Device bus cycle timing implementation in ATE environment
    • Development of ATE based software to monitor device operation and pin status
    • Compiled device assembly language loaded to the device
  • FPGA Functional and Parametric Testing
    • Testing independent of manufacturer proprietary test methods
    • Tools of testing
    • How to develop  the test vectors and configuration vectors
    • How to perform
      • Functional at-speed testing
      • Functional evaluation to actual application design
      • Datasheet AC specs
      • DC testing
    • Characterization of device performance to application is possible
  • Memory Testing
    • DDR /DDR2 /DDR3 / DDR4 SDRAM, SSRAM QDR testing protocols
    • NAND Flash testing protocols
    • Data Retention and Testing

Presented by: Jonathan Hochstetler – VP of Engineering (Host) and Sultan Ali Lilani - Technical Director at Integra Technologies (co-Host)

register-webinar

CORWIL Technology Combines Assembly and Test in One Location

Posted by Susan Campbell on Wed, Dec 17, 2014 @ 07:21 PM

Milpitas, CA, December 18, 2014 - CORWIL Technology now offers assembly and test services to their customers all under one roof. CORWIL announces the completion of the CORWIL Test Division (CTD) move from their Santa Clara location to the newly remodeled CORWIL facility located at 1635 McCarthy Boulevard, Milpitas, CA. The building redesign includes the addition of 21,500 sq ft to house the CTD equipment which includes ATE such as Teradyne UltraFlex and Advantest 93K, Seiko Epson Handlers, Accretech & TEL Wafer Probers, Burn-in testing equipment and End-of-Line equipment such as scan, laser mark, tape and reel.

The newly remolded building allows customers full access to the CORWIL engineering team at one location and helps to minimize overhead and logistics allowing CORWIL to offer competitive prices for manufacturing services in Silicon Valley.“The decision to combine the two businesses in one building was an easy one,” says Matt Bergeron, CORWIL CEO. “This move will allow our customers easier access to a full turnkey solution. They can watch their product move from assembly to test, reducing their time to market and easing logistical concerns.”

Joe Foerstel, CORWIL Test Division General Manager, said “Being in one location allows CORWIL to efficiently take a customer’s device from the beginning at wafer probe, move on to wafer prep and package assembly, perform package final test, then scan/bake/tape & reel, and into FGI or direct ship to the final end destination.  The new facility also allows CORWIL to offer more on the package/device reliability arena with the ability to perform MLS moisture pre-conditioning and then reflow all onsite, to enhance the current offerings of HTOL, LTOL, THB, HAST, and Temp. Cycling.  CORWIL can do it all, or only what the customer requires from wafer probe to shipping the final tested package.”

 CORWIL Technology

 

About CORWIL Technology Corporation

CORWIL Technology provides high quality and responsive semiconductor assembly and test services focusing on Hi-Rel, fast-turn and wafer processing markets. Founded in 1990 and based in Milpitas, CA, CORWIL is the premier U.S. provider of full back-end assembly services and is a key partner with leading medical, Mil/Aero and commercial semiconductor companies. For more information about CORWIL, please visit www.corwil.com.