Advanced Packaging Overview – Design through Assembly and Test FlipChip and Sip Packages
The webinar will discuss:
- Design implications and considerations
- Substrate discussion
- Different approaches on Flip Chip and SiP
- Assembly considerations
- Testing and Qualification
Presented By:
Matt Bergeron, Integra Technologies
Richard McKee, Integra Technologies
Sultan Lilani, Integra Technologies
Jonathan Hochstetler, Integra Technologies