Pick & Place
The pick and place process isn’t just about putting chips in place—it’s a foundational step that ensures performance, yield, and scalability in semiconductor manufacturing.
Integra offers:
Automatic pick and place services to place your dice in:
- GelPack
- Waffle packs
- Tape and reel
Manual pick and place is also available for:
- MEMs
- Topside handling
- Die-sensitive products
- Unpassivated products
- Die picking from wafer maps
- Ultraclean processing of optical or image chips
Individual die ID recording is also available on demand.
Downloads & Resources
