Flip Chip/Interconnect
Interconnect plays an important role in determining the speed and reliability of your product. At Integra, we offer a variety of processes for Aluminum and Gold wire bonding including ultra-fine pitch bonding and the latest in flip chip technology.
- Flip Chip in package (FCIP) such as FCBGA and Flip Chip on board (FCOB)
- Organic laminates or ceramic substrates
- Single or multiple Flip Chip and wire-bonded IC's in hybrids or multi-chip modules
- Bonding of solder bumped dice to substrates with an accuracy as tight as 5 microns
- Solder joints are reflowed in nitrogen under tight temperature control and reflow profiles are available for eutectic and also for lead-free solder
- Gold stud bumping
- Studded die can be thermosonically joined to customer substrates, or soldered using a gold tolerant solder
Downloads & Resources
