Wafer Thinning & Polishing
We specialize in ultrathin precision wafer thinning, all the way down to 25 µm. Our facilities can handle bumped wafers of various bump heights and pitches, and we stock a diverse assortment of front-side tapes to ensure optimal protection for wafers during processing.
Our proprietary dry polishing service removes most subsurface damage that comes with wafer grinding under 100 µm, enabling safer die handling and higher yields.
We work with these wafer materials:
- Glass
- Silicon
- Quartz
- Sapphire
- Laminates
- Piezoelectric
- Gallium Arsenide (GaAs)
- Silicon Germanium (SiGe)
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