Encapsulation
The type of material and method of attachment used to encapsulate a device can be critical in determining the completed package class. At Integra, we offer a large variety of encapsulation options to meet all our customers’ requirements.
- Transfer Mold
- Glob-Top / Dam & Fill
- Lid Options:
- Ceramic
- Glass
- Metal
- Plastic
- Lid Seal Options
- Epoxy
- Glass Frit (hermetic)
- Solder (hermetic)
Downloads & Resources
