Singulated Die Probe
Integra offers a complete suite of singulated die probing and testing services!
Bare die testing is essential for optimizing yields in the following applications:
- Multi-Chip Modules
- System in Package
- Die Reclamation and Repackaging
- Hybrid Microcircuits
Integra die probing and testing capabilities include:
- Die pad-counts from 2 to 8,000+
- Temperatures from -55ºC to +125ºC
- Device complexities from simple discretes to complex FPGAs & Microprocessors
- Device speeds of 50GHz+
- Minimal probe marks on pad
- Precise micro manipulation for X, Y, Z and θ adjustment
