Electrical Test
Integra Technologies has the largest Test Engineering group in the industry, with 25+ Test Development Engineers & 30+ total technical staff (Product Engineers).
Integra provides extensive experience with complex test development:
- Digital & Mixed Signal Devices: Microprocessor, Microcontrollers, FPGA, DSP, ASIC
- Linear: DAC, ADC, Operational Amplifier, Comparator, Multiplexer, Interface, Discrete
- Memory: SDRAM, DDR, SRAM, SSRAM, Flash, EEPROM, EPROM
- Logic: 74xxx, 16/32-bit, ECL
- RF, 8GHz typical and experience to RF 50GHz: PA, LNA, Filter, Mixer
- Can fully test at the wafer, bare die and packaged part level
- Test temps from -65ºC to +200ºC
- In house custom test development
- "Extreme" characterization capability, making 1000's of measurements per device
- Existing test library with 1000+ programmable device test programs from a variety of manufacturers
Total Test Solution
Integra Technologies has been accredited by The Defense Microelectronics Activity (DMEA) as a DoD Category 1A Trusted Integrated Circuit Supplier for Test & Broker Services.
More infoDevice Up-Screening
Up-screening is the testing a device to a wider temperature range than the original manufacturer specified. Up-screening a device does not subject it to any environmental stresses
More infoWafer Probe
Integra Technologies has the engineering talent, equipment and processes in place to support all wafer probe services, including test software development, probe card design/fabric
More infoSingulated Die Probe
Integra offers a complete suite of singulated die probing and testing services!
More infoCustom ASIC & FPGA
Integra offers complex digital testing up to ~1800 pins and 1GHz+. Full ASIC test development and production screening (Wafer Probe and Package Test).
More info