PACKAGING & ASSEMBLY

Integra Technologies offers turnkey IC Packaging services for custom, high-performance and high-reliability microelectronics. This includes a full range of design, lean manufacturing and test services for a variety of applications. Our turnkey services are bolstered by our experience in a variety of IC package material technologies, die attach methodologies (solder, epoxy and eutectic), hermetic devices, and IC package including, but not limited to Ball Grid Array (BGA ) Assembly, QFN, DFN, Chip Scale Package (CSP), and Ceramic leadless Chip Carrier (CLCC).

We help customers introduce their new products to market in the fastest time possible by providing high quality, quick-turn assembly. We support high volume production from our facility in Milpitas, CA or technology transfers into large volume offshore factories.

IC package engineering & assembly services include:

  • Die attach
  • Ultra-fine pitch Wire bond (Al & Au)
  • Flip Chip
  • Encapsulation and transfer mold
  • Substrate solder ball attach
  • Device Singulation