DOWNLOAD YOUR UPDATED GUIDE TODAY
September 2023
Learn how to make your products cost effective and designed for manufacture through the help of this detailed guide!
New equipment and capabilities have been added to this updated guide featuring:
- Wafer Thinning/Individual Die Thinning
- Wafer Dicing/Dice Before Grind (DBG)
- Die Pick-n-Place
- Automated Visual Inspection
- Die Attach
- Flip Chip Assembly
- Wirebond Assembly
- Die Tape & Reel Capability
- Chip-on-Board (COB) Assembly
- Quad Flat No-Lead (QFN) and BGA Assembly
- Laser Mark & Seam Seal
- SiPho Fiber Connection
This guide is provided to assist you in making your products more manufacturable and thus assist in achieving maximum yields.
Fill out the form and receive a copy of 'General Guide For Assembly Services' PDF. Please let us know if you have any questions or Request a Quote today!
