die-prepIntegra Technologies Silicon Valley, previously CORWIL Technologies, specializes in ultra-thin precision wafer thinning and polishing down to 25µm. It routinely handles bumped wafers of wide-ranging bump heights and pitches, and stocks a diverse assortment of front side tapes to provide the best protection for wafers during processing. Materials processed include Silicon, Gallium Arsenide (GaAs), Sapphire, Quartz, Silicon Germanium (SiGe), Laminates, Piezoelectric, and Glass.

Integra Technologies exclusively uses world class fully automated Disco wafer dicing systems for wafers up to 300mm in diameter. Our narrowest cut line can be as low as 15µm. Dice Before Grind (DBG) process is principally used for singulating IC die when normal sawing would create unacceptable levels of chipping and edge damage. Integra Technologies has developed proprietary techniques to allow for the safe singulation of IC devices from a wafer that has been thinned, as thin as 25µm

Other Die Preparation services include automatic Die Pick and place to place die in Waffle Pack, Tape & Reel or GelPack. Manual pick and place is available for unpassivated die, MEMs, and ultra-clean processing of optical or image chips.

Silicon Valley offers automated and manual visual Die Inspections to commercial, MIL-STD-883 (Class B and Class S), and Medical Electronics specifications.