DIE ATTACH

- Die attach using various conductive, non-conductive epoxy and Die-Attach-Film (DAF)
- Die attach of ceramic packages using silver glass adhesive
- Eutectic die attach is a highly controlled die attach process and is perfect for high-reliability and high-accuracy requirement devices. Epoxies and other fluid bonding solutions cannot address high thermal conduction like eutectic die bonds can, making automated eutectic die attach the most viable high-process capability packaging solution.
- Interconnect
- Encapsulation