DIE ATTACH

integra-die-attachDie attach is the foundation of the assembly process; it is the first critical step in the process and getting it right is essential for a reliable finished product. Die-Attach processes available at Integra: 
  • Die attach using various conductive, non-conductive epoxy and Die-Attach-Film (DAF)
  • Die attach of ceramic packages using silver glass adhesive
  • Eutectic die attach is a highly controlled die attach process and is perfect for high-reliability and high-accuracy requirement devices. Epoxies and other fluid bonding solutions cannot address high thermal conduction like eutectic die bonds can, making automated eutectic die attach the most viable high-process capability packaging solution.
  • Interconnect
  • Encapsulation