Die attach is the foundation of the assembly process; it is the first critical step in the process and getting it right is essential for a reliable finished product.
Die-Attach processes available at Integra:
- Die attach using various conductive, non-conductive epoxy and Die-Attach-Film (DAF)
- Die attach of ceramic packages using silver glass adhesive
- Eutectic die attach is a highly controlled die attach process and is perfect for high-reliability and high-accuracy requirement devices. Epoxies and other fluid bonding solutions cannot address high thermal conduction like eutectic die bonds can, making automated eutectic die attach the most viable high-process capability packaging solution.