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Integra is at IMAPS Boston NOW!

Posted by Susan Campbell on Wed, Oct 02, 2019 @ 09:35 AM

imaps-boston-2019Stop by booth #401 at IMAPS Boston today and tomorrow and say Hi to John and Richard.

They are eager to discuss Integra Technologies' capabilities in manufacturing multi-chip devices, surface mount assemblies, and flip chip and wire bond interconnects, enable the development of complete system-in-package solutions to improve performance and reduce footprint.

Integra Technologies at IMAPS Today!

Posted by Susan Campbell on Tue, Oct 01, 2019 @ 08:21 AM

Visit Integra Technologies September 30 - October 3 - Boston, MA - Booth #401


As a high-performance IC packaging provider, Integra Technologies can design, assemble and test custom System-in-Package (SiP) devices. By combining the functionality of a complete system into one packaged device, a SiP solution offers reductions in size, weight and power that are critical to next-generation performance in Aerospace, Industrial and Medical applications. In addition, a SiP solution reduces interconnect and trace lengths, minimizing the impact of parasitic and improving overall electrical performance.

Integra Technologies' capabilities in manufacturing multi-chip devices, surface mount assemblies, and flip chip and wire bond interconnects, enable the development of complete system-in-package solutions to improve performance and reduce footprint.

Stop by the booth today and say Hello to the Integra Team!

IMAPS Advanced System and Technology Conference Follow Up

Posted by Susan Campbell on Mon, Jul 01, 2019 @ 10:18 AM

Thank you to all who visited us last week at the IMAPS Advanced System and Technology Conference. It was a great turn out and we enjoyed speaking with you all. Please let us know if you have any questions or projects to discuss with our sales team. We look forward to hearing from you!

IMAPS 2019    kirk-imaps2019

integra-find-out-more

Heterogeneous Integration Roadmap Symposium 2/21-2/22

Posted by Susan Campbell on Mon, Feb 25, 2019 @ 11:47 AM

HIR-conf-2019-1There was a great turn out at this year's Heterogeneous Integration Roadmap Symposium in Milpitas, CA last week. We would like to thank all who attended!

HIR-conf-2019-2As a high-performance IC packaging provider, Integra Technologies can design, assemble and test custom System-in-Package (SiP) devices. By combining the functionality of a complete system into one packaged device, a SiP solution offers reductions in size, weight and power that are critical to next-generation performance in Aerospace, Industrial and Medical applications. In addition, a SiP solution reduces interconnect and trace lengths, minimizing the impact of parasitic and improving overall electrical performance.

Integra Technologies' capabilities in manufacturing multi-chip devices, surface mount assemblies, and flip chip and wire bond interconnects, enable the development of complete system-in-package solutions to improve performance and reduce footprint.