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CORWIL Focuses on MedTech Industries

Posted by Susan Campbell on Mon, Aug 11, 2014 @ 02:42 PM

CORWIL Medical

CORWIL Technology is a U.S. based OSAT with a unique focus on Medical Device and Biotech industries. Our Bay Area facilities are state of the art, and boast an unparalleled range of high-end equipment and capabilities in both assembly and test disciplines, that when tagged with CORWIL’s highly skilled and experienced engineering team and ISO 13485:2003 certification, make CORWIL the ideal NPI and production partner for leading-edge Med-Tech applications such as DNA Sequencing, ICD/Pacemaker, Neuromodulation, Medical Imaging, and more. 

One of the biggest differentiators between CORWIL and other domestic subcontractors is our significant investment in back-end wafer processing – CORWIL has more wafer thinning, dicing, inspection, and die-sort capacity than any other OSAT in North America, and is positioned to support both high-mix/low-volume, as well as mid to high-volume die-prep requirements, from individual die, all the way through 300mm wafer sizes. CORWIL also has vast experience in exotic material processing such as AlN, GaN, GaAs, InP, SiC, and Sapphire. 

In our Class 1000 and 10000 cleanrooms, CORWIL's services include:

  • Wafer Thinning & Polishing
    • 300 mm wafer
  • Wafer Dicing
    • Largest array of dicing saws stateside
    • Multi-project wafers
  • Assembly
    • Wirebond
    • Flip Chip
  • Encapsulation
    • Flow cell attach
    • Custom dam & fill configurations
  • Plastic Molding
  • Environmental Test
  • Mechanical Test
  • Electrical Test

optical inspectionCORWIL’s wafer and die inspection capabilities comprise of advanced AOI systems (Automated Optical Inspection), as well as highly skilled technicians trained and experienced to MIL-STD-883, Class Levels Q & V, with DLA certification to MIL-PRF-38535. Our assembly portfolio spans a wide range of JEDEC and custom package types such as ceramic (hermetic and non-hermetic), plastic QFN/DFN, BGA, LGA, CSP, COB, and MCM, with numerous material options in die-attach, interconnect, and seal. CORWIL also offers a wide range of test services, including environmental, mechanical, and electrical, with an ATE portfolio spanning analog, digital, mixed-signal, and RF, complete with probers and handlers to support both wafer-sort and package-test. 

CORWIL is QML listed (levels Q&V), ISO 9001:2008, ISO 13485:2003, and is ITAR registered and compliant.

 

ISO Certification

CORWIL Increases Molding Capabilities with a FICO MMS-W Molding System

Posted by Susan Campbell on Fri, Nov 22, 2013 @ 01:29 PM

CORWIL INCREASES MOLDING CAPABILITIES WITH A FICO MMS-W MOLDING SYSTEM

CORWIL-FICOMilpitas, CA, November 22, 2013 – CORWIL Technology announced the addition of a new FICO MMS-W Molding system. With this system, CORWIL has developed the capability of offering industry standard Quad Flat No Lead (QFN) packages that feature an MSL moisture sensitivity level of 1, per J-STD-020, with a maximum peak reflow temperature of 260 °C. This next generation multi plunger molding machine also includes “vacuum assisted molding” which further enhances quality. 

This addition, coupled with our recent addition of the ASM Xtreme wire bonder, strengthens CORWIL’s capability for fine pitch, high density packaging for BGA, QFN and CSP products with complex multi-tier wire bonding layout using wire size down to 0.5 mil.  “As several of our Mil/Aero customers migrate from conventional ceramic packaging to plastic packaging, CORWIL identified a critical need for a molding system that would satisfy the needs of these demanding customers. With this system, CORWIL has the right molding capabilities to service this market,” said Willy Bowman, CORWIL’s Director of Engineering. “Our Search for the right molding partner led us to FICO who was able to  deliver a system that helps us meet the stringent quality requirements of our Mil/Aero & Medical customers as well as providing the flexibility required for Commercial and Quick-Turn customers,” he added.

This purchase emphasizes CORWIL’s commitment to acquire the best equipment and capabilities to serve the Semiconductor Industry’s domestic outsourced assembly and test requirements.  

 

About CORWIL Technology Corporation

CORWIL Technology provides high quality and responsive semiconductor assembly and test services focusing on Hi-Rel, fast-turn and wafer processing markets. Founded in 1990 and based in Milpitas, CA, CORWIL is the premier U.S. provider of full back-end assembly services and is a key partner with leading medical, Mil/Aero and commercial semiconductor companies. For more information about CORWIL, please visit www.corwil.com.