Upcoming Webinars From Integra Technologies

Posted by Susan Campbell on Thu, Oct 01, 2020 @ 02:07 PM
Sign up now for one of Integra's Webinars coming up this month:
By request, Integra Technologies will be offering the
'Obsolescence Management for EEE Parts' Webinar AGAIN!
Thursday, October 22nd
11:00 a.m. PST

Advanced Packaging Overview –
Design through Assembly and Test: FlipChip and SiP Packages
Thursday, October 22nd
1:00 p.m. PST 

Have Questions?
Contact Integra Technologies


Miss one of our previous webinars? Download the notes today:


Mil-Std-1580 DPA Including DPAs for Copper Bond Wire PEMs

Obsolescence Management for EEE Parts - Learn more about Integra's services to support Military/Space/Aerospace companies threatened with diminishing sources of supply for semiconductor and related EEE parts

Testing of Complex FPGA's, Memory and Microprocessors - Integra has developed over 10,000 test programs including these complex devices. This webinar will explore the nuances of how such complex devices are tested.

Standards of PEM Qual and Technical Requirements Review - Integra is the leader in performing PEM (Plastic Encapsulated Microcircuits) screening, qualification and DPA for the Aerospace and Defense market.



Huntsville • Redstone Arsenal Small Business Contracting Conference & Expo
Wed, Oct 21, 2020, 7:00am - 4:00pm
Von Braun Convention Center, Huntsville, AL 35801

Your Single Source Turnkey Solution, from Wafer Processing to Final Test with Locations Throughout the U.S.!



Webinar: Mil-Std-1580 DPA

Posted by Susan Campbell on Fri, Aug 28, 2020 @ 06:39 PM
Due to popular demand we will be presenting the webinar:
Mil-Std-1580 DPA Including Copper Bond Wire PEMs
Wednesday, September 9th
1:00 p.m. PST


  • Basics of Mil Std DPA
    • Non-Destructive Testing
      • External Visual
      • Real Time X-Ray
      • XRF/Prohibited Material Inspection
      • PIND
      • Hermetic Seal
      • Acoustic Microscopy (SAM)
    • Destructive Testing
      • Mechanical/Laser Ablation/Chemical Decap
      • Internal Visual Inspection
      • Bond Pull Testing
      • Die Shear Testing
      • SEM Metallization
      • Cross Section
  • Flip Chip DPA
    • Die Shear/Ball Shear
    • Die Pull
  • Copper Bond Wire DPA
    • Splashing
    • IMC
    • Microcracks
    • Bond Pull
  • Mil-Std-1580 Rev Changes

Presented by Rachel Garcia, DPA Lab Technical Director and Sultan Lilani, Technical Support Director at Integra Technologies