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Upcoming Webinars From Integra Technologies

Posted by Susan Campbell on Thu, Oct 01, 2020 @ 02:07 PM
Sign up now for one of Integra's Webinars coming up this month:
 
By request, Integra Technologies will be offering the
'Obsolescence Management for EEE Parts' Webinar AGAIN!
Thursday, October 22nd
11:00 a.m. PST
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Advanced Packaging Overview –
Design through Assembly and Test: FlipChip and SiP Packages
 
Thursday, October 22nd
1:00 p.m. PST 
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Have Questions?
 
Contact Integra Technologies

 


Miss one of our previous webinars? Download the notes today:

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Mil-Std-1580 DPA Including DPAs for Copper Bond Wire PEMs

Obsolescence Management for EEE Parts - Learn more about Integra's services to support Military/Space/Aerospace companies threatened with diminishing sources of supply for semiconductor and related EEE parts

Testing of Complex FPGA's, Memory and Microprocessors - Integra has developed over 10,000 test programs including these complex devices. This webinar will explore the nuances of how such complex devices are tested.

Standards of PEM Qual and Technical Requirements Review - Integra is the leader in performing PEM (Plastic Encapsulated Microcircuits) screening, qualification and DPA for the Aerospace and Defense market.


VISIT US:

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Huntsville • Redstone Arsenal Small Business Contracting Conference & Expo
Wed, Oct 21, 2020, 7:00am - 4:00pm
Von Braun Convention Center, Huntsville, AL 35801
 
 

Your Single Source Turnkey Solution, from Wafer Processing to Final Test with Locations Throughout the U.S.!

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Integra Technologies is OPEN

Posted by Susan Campbell on Tue, Apr 21, 2020 @ 09:14 AM

Integra Technologies is OPEN

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BGA's with Tin Lead Solder Balls

Posted by Susan Campbell on Tue, Nov 05, 2019 @ 09:35 AM

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No Re-Balling Required with Integra’s On-shore Plastic BGA Assembly Capabilities

  • bga-tin-lead2We offer open-tooling (JEDEC Standards) CSBGA (CSBGA (CHIP SCALE BGA) at our Milpitas, Calif facility
    • Body sizes: Virtually Unlimited
    • Mold caps: 0.60, 0.80, 1.0 1.25mm
    • Total profiles vary by substrate
    • Ball pitch: 0.40mm & Larger
  • We attach the tin/lead solder during the assembly process on our BGA packages. No re-balling or re-work needed; one reflow process
  • Meets the requirements for Commercial, Industrial, Medical and Aerospace customers
  • If custom BGA package is required, please contact us. We will tool custom plastic BGAs with reasonable development NREs

Our engineering team works with customers to help identify and solve existing and potential IC packaging issues, sparing customers from costly packaging delays and potential failures due to rework. We will develop manufacturable package solutions for next-generation, high-volume production. Integra Technologies has the experience to meet your most demanding advanced packaging challenges including SiP, MCM, RF Modules and Stacked assemblies.

Tin/Lead Solder Balls for your BGAs from the get-go; look no further than Integra Technologies, Silicon Valley

FIND OUT MORE