Integra Technologies is OPEN
No Re-Balling Required with Integra’s On-shore Plastic BGA Assembly Capabilities
Our engineering team works with customers to help identify and solve existing and potential IC packaging issues, sparing customers from costly packaging delays and potential failures due to rework. We will develop manufacturable package solutions for next-generation, high-volume production. Integra Technologies has the experience to meet your most demanding advanced packaging challenges including SiP, MCM, RF Modules and Stacked assemblies.
Tin/Lead Solder Balls for your BGAs from the get-go; look no further than Integra Technologies, Silicon Valley