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INTEGRA TECHNOLOGIES ANALYSIS LAB GRAND OPENING

Posted by Susan Campbell on Thu, Sep 02, 2021 @ 08:09 AM

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Friday was an exciting day at Integra Technologies' Wichita facility as they were joined by Congressman Ron Estes and local news media to announce the Grand Opening of their Integra Technologies Analysis Lab

The state of the art 2,700 square foot lab expansion houses 15 new pieces of specialized test equipment allowing for 150 projects to be ran per week at the new lab. Onsite DPA will give Integra the ability to reduce the time needed to complete component qualifications that directly impact time to market, allowing customers to pull in schedules to meet the nation's demand for qualified microelectronics.

Watch KSN's Live Coverage of the event:

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FULL PRESS RELEASE:

Wichita, KANS. (August 27, 2021) - Integra Technologies, a world leader in semiconductor packaging, assembly, test, characterization and related services, today announced the opening of the Integra Analysis Lab at the Integra Technologies’ headquarters in Wichita, Kansas.

 The state of the art 2,700 square foot lab expansion will house 15 new pieces of specialized test equipment allowing for 150 projects to be ran per week at the new lab. Onsite DPA will give Integra the ability to reduce the time needed to complete component qualifications that directly impact time to market, allowing customers to pull in schedules to meet the nation’s demand for qualified microelectronics.

Brett Robinson, Integra Technologies President and CEO said, “The $2 million plus capital investment furthers Integra’s commitment to support the nation’s infrastructure by providing service to the Department of Defense and space customers.”

The new Lab will bring approximately 40 engineering positions and non-technical operator positions. As DPA processes are unique to Integra in Wichita, Integra will provide onsite training to develop the expertise needed to operate the equipment and perform the analytical analyses.

Destructive Physical Analysis (DPA) is a systematic, logical and detailed analysis of electronic components during various stages of disassembly to obtain information about the quality and potential reliability concerns associated with the parts based on industry standard information and characteristics of device failures. Physical Analysis allows end users to select parts that will reliably perform as designed in their critical applications for the life of the program.

 

Webinar: Mil-Std-1580 DPA

Posted by Susan Campbell on Fri, Aug 28, 2020 @ 06:39 PM
Due to popular demand we will be presenting the webinar:
Mil-Std-1580 DPA Including Copper Bond Wire PEMs
AGAIN!
Wednesday, September 9th
1:00 p.m. PST
 
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TOPICS INCLUDE:
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  • Basics of Mil Std DPA
    • Non-Destructive Testing
      • External Visual
      • Real Time X-Ray
      • XRF/Prohibited Material Inspection
      • PIND
      • Hermetic Seal
      • Acoustic Microscopy (SAM)
    • Destructive Testing
      • Mechanical/Laser Ablation/Chemical Decap
      • Internal Visual Inspection
      • Bond Pull Testing
      • Die Shear Testing
      • SEM Metallization
      • Cross Section
  • Flip Chip DPA
    • Die Shear/Ball Shear
    • Die Pull
  • BGA DPA
  • Copper Bond Wire DPA
    • Splashing
    • IMC
    • Microcracks
    • Bond Pull
  • Mil-Std-1580 Rev Changes

Presented by Rachel Garcia, DPA Lab Technical Director and Sultan Lilani, Technical Support Director at Integra Technologies

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