Due to popular demand we will be presenting the webinar:
Mil-Std-1580 DPA Including Copper Bond Wire PEMs
AGAIN!
Wednesday, September 9th
1:00 p.m. PST
TOPICS INCLUDE:
- Basics of Mil Std DPA
- Non-Destructive Testing
- External Visual
- Real Time X-Ray
- XRF/Prohibited Material Inspection
- PIND
- Hermetic Seal
- Acoustic Microscopy (SAM)
- Destructive Testing
- Mechanical/Laser Ablation/Chemical Decap
- Internal Visual Inspection
- Bond Pull Testing
- Die Shear Testing
- SEM Metallization
- Cross Section
- Non-Destructive Testing
- Flip Chip DPA
- Die Shear/Ball Shear
- Die Pull
- BGA DPA
- Copper Bond Wire DPA
- Splashing
- IMC
- Microcracks
- Bond Pull
- Mil-Std-1580 Rev Changes
Presented by Rachel Garcia, DPA Lab Technical Director and Sultan Lilani, Technical Support Director at Integra Technologies
