Capabilities
Die Prep
Wafer thinning
Wafer dicing
Pick and Place
Die Inspection
Packaging & Assembly
SiP/MCM
Die attach
Standard IC Packages
Flip Chip Interconnect
Encapsulation
Quick Turn
Electrical Test
Total Test
Device Upscreen
Wafer Probe
Singulated Die Probe
FPGA
Custom ASIC/FPGA
Reliability & Qualification
PEM Qualification
Cu Wire Evaluation
ESD Services
Other
DPA & FA
Laser ablation
DPA
FA
Other
Counterfeit Detection
Other Services
Obsolescence Management
BOM Management
Parts Management Program
Facilities
Contact
Quality
Careers
Resources
About Integra
Media
News & Updates
FAQ
Webinars
Videos
Presentations
Guides
White Papers
News and Updates
The latest news and education on semiconductor assembly, test, qualification and more!
Media Inquiries
automated test equipment
Testing of Complex FPGAs, Memory and Microprocessors
Read More
