Die Attach
Die attach is a critical step in semiconductor packaging where the silicon die (or chip) is securely mounted onto a substrate, lead frame, or package base. This process forms the physical and thermal bridge between the die and the rest of the device, directly impacting performance, reliability, and lifespan. Whether using epoxy, solder, or sintering techniques, the die attach process must be carefully controlled for alignment, voids, and bond quality—making it one of the foundational steps in high-quality semiconductor packaging.
Explore some of our commonly asked questions:
Q: What type of die attach does Integra do?
A: Die attach using various conductive, non conductive epoxy and DAF ( Die-Attach-Film) as well as:
- Die attach of ceramic, hybrid packages using silver glass adhesive
- Eutectic die attach using the SST 5100 vacuum system (tooling required)
Integra will need to verify availability of preform sizes vs. die size - Sintered Silver also available under Engineering Control
Q: What are your X/Y placement accuracies?
A: MAT- 6400 die bonder: DIE ATTACH +/-5um @ 3sigma - Application dependent (+/- 10 um after die attach cure)
Data-con 2200 APM die bonder:
DIE ATTACH +/- 10 um (+/- 15 um after die attach cure)
Q: What die sizes can you work with?
A: 750µm to 40mm typical and larger or smaller with engineering review
Q: What kind of bond line thickness control does Integra have?
A: Pressure and time control (for epoxy) : Target BLT +/- 12.5 um (die size dependent) Height or distance control (for silver glass) : Target BLT +/- 12.5 um
Q: For manual die attach how do you control bond line thickness?
A: We recommend the use of glass bead spacers for BLT control
Q: What kind of fillet and epoxy coverage do you guarantee?
A: We guarantee to meet or exceed MIL-STD-883, Methods 2010, 2012 and 2030