Compression Molding
Semiconductor Compression Molding is a highly controlled manufacturing process that encapsulates semiconductor devices—such as integrated circuits (ICs), power modules, and advanced microelectronic assemblies—within robust protective packaging materials. This encapsulation process plays a critical role in safeguarding delicate electronic components against mechanical stress, environmental contaminants, and thermal cycling, all of which are prevalent in demanding applications across aerospace, defense, medical, automotive, and communications sectors.
Through careful material selection and precise molding parameters, compression molding enhances long-term device reliability and optimizes performance characteristics by maintaining electrical integrity, improving heat dissipation, and supporting the mechanical stability required for mission-critical environments. The result is a durable semiconductor package engineered to meet stringent industry standards while facilitating high-yield production and operational efficiency.
Q: What is compression molding?
A: Compression molding involves placing liquid or granular resin directly into the cavity, where it melts before the workpiece is submerged for resin molding. This method minimizes waste by eliminating the need for a gate or runner, as required in the transfer method, thereby achieving nearly 100% resin efficiency.
Q: What are the benefits of compression molding?
A: A notable advantage we've observed is the absence of 'flows' within the molding area, reducing the likelihood of wire sweep for wire-bonded parts. Other benefits include:
- high production yield
- uniform encapsulation
- excellent mechanical properties
- thermal management capabilities
- cost-effective
Q: What compression molding system does Integra use?
A: Integra's system is manufactured by Towa -
- Standard strip = 200 x 70mm
- Reduced wire sweep void
- Granular mold compound
- Film assisted
- Mold underfill capable
- Capable of wafer level molding
By providing robust and resilient packaging, compression molding ensures that each device can withstand the rigors of demanding environments, delivering unparalleled reliability and efficiency.