Testing 2.5D Heterogeneous Packaged Parts
Testing 2.5D heterogeneous packaged parts is a crucial step in the manufacturing process to deliver high-performance, reliable, and cutting-edge semiconductor solutions for various applications, including data centers, high-performance computing, telecommunications, and automotive electronics.
Frequently asked questions:
Q: Does Integra test 2.5D HI packages?
A: Yes! Integra has the capability to test 2.5D HI packages
Q: What are the main challenges associated with 2.5D HI Testing?
A:
- Cost to test is an issue
- Different manufacturers of die/packages with chiplets makes obtaining optimal test mode information very difficult – cost to test is exponentially higher
- Conventional test equipment does not support full functional testing at HI level
- Parallelism is impossible with current technologies
- Number of I/Os make it very difficult to do comprehensive functional testing
- Power, current, thermal, signal integrity management is a big task
- Inadequate post - integration testing does not allow for comprehensive Reliability Testing
- KGD is not an answer for an integrated package – mostly addresses pre-integration testing
- Having a comprehensive EDA tool support is important
Q: What are the benefits of HI testing?
A:
- Ensures the reliability and durability of advanced semiconductor packages.
- Identifies potential defects or issues before deployment, reducing the risk of failures in the field.
- Guarantees that the package meet performance specifications and industry standards.
- Improves the overall quality and longevity of electronic devices incorporating these packages.