Flip Chip package technology offers a range of benefits including high pin count, high signal density, better power dissipation, low signal inductance, and good power/ground connectivity, and is ideal for high speed interfaces (including RF) that wire bonds cannot support.
In this interactive tutorial you will learn more about:
- Flip Chip Benefits
- Industries where used
- Bumping and RDL
- Substrate
- Implementations and Test
- Qualification Considerations
Download the notes below from April 14th tutorial, or contact us with any questions: TechnicalHotline@integra-tech.com