WEBINAR: Advanced Packaging Overview – Design through Assembly and Test FlipChip and Sip Packages

webinar-integra-technologiesYou may have missed this webinar but you can still receive the notes.

The webinar will discuss:
  • Design implications and considerations
  • Substrate discussion
  • Different approaches on Flip Chip and SiP
  • Assembly considerations
  • Testing and Qualification

Please fill out the quick form below and the notes will be sent to you.

Contact us with any questions: TechnicalHotline@integra-tech.com

Advanced Packaging Overview Notes